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Journal Articles

Embedded Cooling for Wide Bandgap Power Amplifiers: A Review

A. Bar-Cohen, J. J. Maurer, D. H. Altman

J. Electron. Packag. December 2019, 141(4): 040803.

Paper No: EP-18-1067

DOI: https://doi.org/10.1115/1.4043404

Published Online: July 30, 2019

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Topics: Cooling, Diamonds, Gallium nitride, Microfluidics, Transistors, Thermal conductivity, Temperature, Junctions, Heat, Thermal management

Proceedings Papers

Structural Reliability of Novel 3-D Integrated Thermal Packaging for Power Electronics

S. Khanna, P. McCluskey, M. Manno, A. Bar-Cohen, B. Yang, M. Ohadi

Proc. ASME. IMECE2015, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T13A039, November 13–19, 2015

Paper No: IMECE2015-53749

DOI: https://doi.org/10.1115/IMECE2015-53749

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Topics: Electronics, Packaging, Reliability, Thermal conductivity, Diamonds, Failure, Composite materials, Solder joints, Cooling, Copper

Journal Articles

In Memoriam: Professor Arthur E. Bergles (1935–2014), the Pioneering Advocate of Enhanced Heat Transfer and Energy Conservation

R. M. Manglik, M. K. Jensen, A. Bar-Cohen, Z. H. Ayub

J. Thermal Sci. Eng. Appl. September 2015, 7(3): 030101.

Paper No: TSEA-14-1150

DOI: https://doi.org/10.1115/1.4027949

Published Online: September 1, 2015

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Topics: Energy conservation, Engineering teachers, Heat transfer

Journal Articles

In Memoriam: Professor Arthur E. Bergles (1935–2014), the Pioneering Advocate of Enhanced Heat Transfer and Energy Conservation

R. M. Manglik, M. K. Jensen, A. Bar-Cohen, Z. H. Ayub

J. Heat Transfer. December 2014, 136(12): 120101.

Paper No: HT-14-1415

DOI: https://doi.org/10.1115/1.4027883

Published Online: October 27, 2014

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Topics: Energy conservation, Engineering teachers, Heat transfer

Journal Articles

Thermal Management of Time-Varying High Heat Flux Electronic Devices

T. David, D. Mendler, A. Mosyak, A. Bar-Cohen, G. Hetsroni

J. Electron. Packag. June 2014, 136(2): 021003.

Paper No: EP-13-1064

DOI: https://doi.org/10.1115/1.4027325

Published Online: April 29, 2014

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Topics: Flow (Dynamics), Heat flux, Heat sinks, Microchannels, Temperature, Fluids, Steady state, Vapors, Wall temperature, Boiling

Proceedings Papers

Energy Efficient Two-Phase Micro-Cooler Design for a Concentrated Photovoltaic Triple Junction Cell

A. Reeser, P. Wang, A. Bar-Cohen, G. Hetsroni

Proc. ASME. IMECE2012, Volume 6: Energy, Parts A and B, 1077-1092, November 9–15, 2012

Paper No: IMECE2012-85895

DOI: https://doi.org/10.1115/IMECE2012-85895

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Topics: Design, Junctions, Microcoolers, Cooling, Solar cells, Solar energy, Boiling, Coolers, Critical heat flux, Energy consumption

Journal Articles

Minimum Mass Polymer Seawater Heat Exchanger for LNG Applications

P. Luckow, A. Bar-Cohen, P. Rodgers

J. Thermal Sci. Eng. Appl. September 2009, 1(3): 031009.

DOI: https://doi.org/10.1115/1.4001239

Published Online: April 23, 2010

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Topics: Heat exchangers, Heat transfer, Polymers, Seawater, Thermal conductivity, Polymer composites, Manufacturing, Titanium, Fins, Methane

Journal Articles

Combined Pressure and Subcooling Effects on Pool Boiling From a PPGA Chip Package

A. A. Watwe, A. Bar-Cohen, A. McNeil

J. Electron. Packag. June 1997, 119(2): 95–105.

DOI: https://doi.org/10.1115/1.2792226

Published Online: June 1, 1997

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Topics: Pool boiling, Pressure, Subcooling, Critical heat flux, Boiling, Nucleate pool boiling

Journal Articles

Pool Boiling Heat Transfer With an Array of Flush-Mounted, Square Heaters on a Vertical Surface

S. M. You, T. W. Simon, A. Bar-Cohen

J. Electron. Packag. March 1997, 119(1): 17–25.

DOI: https://doi.org/10.1115/1.2792195

Published Online: March 1, 1997

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Topics: Heat transfer, Pool boiling, Boiling, Bubbles, Fluids, Heat, Heating, Aluminum, Computer cooling, Platinum

Journal Articles

Effects of Dissolved Gas Content on Pool Boiling of a Highly Wetting Fluid

S. M. You, T. W. Simon, A. Bar-Cohen, Y. S. Hong

J. Heat Transfer. August 1995, 117(3): 687–692.

DOI: https://doi.org/10.1115/1.2822631

Published Online: August 1, 1995

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Topics: Boiling, Fluids, Pool boiling, Wetting, Computer cooling, Heat transfer, Cylinders, Electronic equipment, Heat flux, Heating

Journal Articles

Thermofluid Design of Single-Phase Submerged-Jet Impingement Cooling for Electronic Components

D. E. Maddox, A. Bar-Cohen

J. Electron. Packag. September 1994, 116(3): 237–240.

DOI: https://doi.org/10.1115/1.2905692

Published Online: September 1, 1994

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Topics: Design, Electronic components, Impingement cooling, Thermofluids

Journal Articles

Thermal and Hydrodynamic Phenomena in a Horizontal, Uniformly Heated Steam-Generating Pipe

A. Bar-Cohen, Z. Ruder, P. Griffith

J. Heat Transfer. August 1987, 109(3): 739–745.

DOI: https://doi.org/10.1115/1.3248152

Published Online: August 1, 1987

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Topics: Pipes, Steam, Flow (Dynamics), Water, Boiler tubes, Flux (Metallurgy), Heat, Pressure, Temperature, Vapors

Journal Articles

Thermosyphon Boiling in Vertical Channels

A. Bar-Cohen, H. Schweitzer

J. Heat Transfer. November 1985, 107(4): 772–778.

DOI: https://doi.org/10.1115/1.3247503

Published Online: November 1, 1985

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Topics: Boiling, Heat transfer, Heat flux, Ceramics, Cooling, Cooling systems, Flow (Dynamics), Integrated circuits, Plates (structures), Pool boiling

Journal Articles

Thermally Optimum Spacing of Vertical, Natural Convection Cooled, Parallel Plates

A. Bar-Cohen, W. M. Rohsenow

J. Heat Transfer. February 1984, 106(1): 116–123.

DOI: https://doi.org/10.1115/1.3246622

Published Online: February 1, 1984

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Topics: Natural convection, Plates (structures), Composite materials, Optimization, Boundary-value problems, Electronic packaging, Energy dissipation, Heat transfer, Heat transfer coefficients

Journal Articles

Optimum Cylindrical Pin Fin

A. Sonn, A. Bar-Cohen

J. Heat Transfer. November 1981, 103(4): 814–815.

DOI: https://doi.org/10.1115/1.3244547

Published Online: November 1, 1981

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Journal Articles

International Trends in Engineering Design Education—A Partial View

A. Bar-Cohen

J. Mech. Des. October 1979, 101(4): 540–545.

DOI: https://doi.org/10.1115/1.3454098

Published Online: October 1, 1979

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Topics: Education, Engineering design, Design, Engineering students, Innovation, Students, Undergraduate students

Journal Articles

Fin Thickness for an Optimized Natural Convection Array of Rectangular Fins

A. Bar-Cohen

J. Heat Transfer. August 1979, 101(3): 564–566.

DOI: https://doi.org/10.1115/1.3451032

Published Online: August 1, 1979

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Topics: Fins, Natural convection

Journal Articles

Editorial/Conference Focus

C. W. McLarnan, A. Bar-Cohen

J. Mech. Des. October 1978, 100(4): 585–586.

DOI: https://doi.org/10.1115/1.3453972

Published Online: October 1, 1978

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Journal citation

NARROW

Embedded Cooling for Wide Bandgap Power Amplifiers: A Review

Structural Reliability of Novel 3-D Integrated Thermal Packaging for Power Electronics

In Memoriam: Professor Arthur E. Bergles (1935–2014), the Pioneering Advocate of Enhanced Heat Transfer and Energy Conservation

In Memoriam: Professor Arthur E. Bergles (1935–2014), the Pioneering Advocate of Enhanced Heat Transfer and Energy Conservation

Thermal Management of Time-Varying High Heat Flux Electronic Devices

Energy Efficient Two-Phase Micro-Cooler Design for a Concentrated Photovoltaic Triple Junction Cell

Minimum Mass Polymer Seawater Heat Exchanger for LNG Applications

Combined Pressure and Subcooling Effects on Pool Boiling From a PPGA Chip Package

Pool Boiling Heat Transfer With an Array of Flush-Mounted, Square Heaters on a Vertical Surface

Effects of Dissolved Gas Content on Pool Boiling of a Highly Wetting Fluid

Thermofluid Design of Single-Phase Submerged-Jet Impingement Cooling for Electronic Components

Thermal and Hydrodynamic Phenomena in a Horizontal, Uniformly Heated Steam-Generating Pipe

Thermosyphon Boiling in Vertical Channels

Thermally Optimum Spacing of Vertical, Natural Convection Cooled, Parallel Plates

Optimum Cylindrical Pin Fin

International Trends in Engineering Design Education—A Partial View

Fin Thickness for an Optimized Natural Convection Array of Rectangular Fins

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