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Keywords: warpage
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Journal Articles
Majid Mohammadhosseinzadeh, Hyeongtae Kim, Hossein Ghorbani-Menghari, Jungbin Park, Namhyun Kang, Myung Keun Jung, Seung Ryul Na, Ji Hoon Kim
Publisher: ASME
Article Type: Research Papers
J. Manuf. Sci. Eng. July 2025, 147(7): 071001.
Paper No: MANU-24-1597
Published Online: March 13, 2025
...Majid Mohammadhosseinzadeh; Hyeongtae Kim; Hossein Ghorbani-Menghari; Jungbin Park; Namhyun Kang; Myung Keun Jung; Seung Ryul Na; Ji Hoon Kim This study examines the influence of printed circuit board (PCB) warpage patterns on solder paste distribution during the stencil printing process (SPP...
