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Journal Articles

Auto-Labeling for Pattern Recognition of Wafer Defect Maps in Semiconductor Manufacturing

Shu-Kai S. Fan, Pei-Chen Chen, Chih-Hung Jen, Kanchana Sethanan
Journal: Journal of Manufacturing Science and Engineering
Publisher: ASME
Article Type: Research Papers
J. Manuf. Sci. Eng. July 2024, 146(7): 070904.
Paper No: MANU-23-1598
https://doi.org/10.1115/1.4065118
Published Online: April 22, 2024
View Article titled, Auto-Labeling for Pattern Recognition of Wafer Defect Maps in Semiconductor Manufacturing
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Topics: Semiconductor wafers, Integrated circuit fabrication
Journal Articles

Editorial

Albert Shih
Journal: Journal of Manufacturing Science and Engineering
Publisher: ASME
Article Type: Editorial
J. Manuf. Sci. Eng. September 2023, 145(9): 090201.
Paper No: MANU-23-1357
https://doi.org/10.1115/1.4062726
Published Online: June 30, 2023
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Topics: Manufacturing, Integrated circuit fabrication, Engineers
Journal Articles

Multicultural Diversity Workforce and Global Technology Collaboration Empowered Semiconductor Manufacturing Excellence in Taiwan: A Manufacturing Engineer’s Perspective

Albert J. Shih
Journal: Journal of Manufacturing Science and Engineering
Publisher: ASME
Article Type: Review Articles
J. Manuf. Sci. Eng. September 2023, 145(9): 090801.
Paper No: MANU-23-1179
https://doi.org/10.1115/1.4062729
Published Online: June 30, 2023
View Article titled, Multicultural Diversity Workforce and Global Technology Collaboration Empowered Semiconductor Manufacturing Excellence in Taiwan: A Manufacturing Engineer’s Perspective
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Topics: Integrated circuit fabrication, Manufacturing, Semiconductors (Materials), Cultural diversity, Collaboration
Journal Articles

Semi-Supervised Learning for Anomaly Classification Using Partially Labeled Subsets

Joseph Cohen, Jun Ni
Journal: Journal of Manufacturing Science and Engineering
Publisher: ASME
Article Type: Research Papers
J. Manuf. Sci. Eng. June 2022, 144(6): 061008.
Paper No: MANU-21-1317
https://doi.org/10.1115/1.4052761
Published Online: December 3, 2021
View Article titled, Semi-Supervised Learning for Anomaly Classification Using Partially Labeled Subsets
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Topics: Algorithms, Computer-aided engineering, Dimensions, Feature extraction, Machine learning, Principal component analysis, Integrated circuit fabrication, Artificial intelligence