The rapid evolution of electronic and information technology has increased the performance of the electronic processors significantly. Achieving the optimal performance in a smart electronic device poses a serious challenge as the heat generated during operation will reduce the performance of the device which makes thermal management a determinant factor. Powder injection molding (PIM) is an appropriate and relatively new technology used for mass production of small delicate parts with complex shapes and desired properties. One of the latest advances in the PIM process is the production of metal matrix nanocomposites with huge industrial applications, particularly in electronics manufacturing. Manufacturing of efficient complex-shaped nanocomposites, as thermal management components (passive heatsink), could be achieved through the PIM process. On the other hand, what could pose a challenge is the presence of nanoparticles affecting on the different stages of PIM process including feedstock preparation, molding, debinding, and sintering. In this paper, the effect of nanoparticles on different stages of PIM for the production of heatsinks is investigated. Then, the manufacturing of Cu-, Al-, and Mg-based nanocomposites by powder injection molding, as heatsinks, is reviewed followed by investigating the related advantages and limitations.