As various small electronics components are being rapidly moved along an assembly line, their leads must be cut and clinched into holes of a circuit board for the next soldering operation. This process must be achieved economically both in time, and in combating wear by preserving the cutting tools’ sharpness. The present study investigates the shearing action and subsequent fracture in cutting. Plastic analysis for both cutting and forming (clinching) is presented with the support of measured data obtained on a prototype machine employed in the research. Wear analysis of the cutting surfaces leads to a recognition of the role played by various geometric parameters such as lead shape, cutter and anvil angles, cutter and anvil distance, etc.
Mechanical Study for the Cutting and Clinching Process of Electronic Component Leads
Engel, P. A., Wu, K. R., Zhai, X., and Janisiewicz, S. (May 1, 1998). "Mechanical Study for the Cutting and Clinching Process of Electronic Component Leads." ASME. J. Manuf. Sci. Eng. May 1998; 120(2): 279–286. https://doi.org/10.1115/1.2830125
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