As various small electronics components are being rapidly moved along an assembly line, their leads must be cut and clinched into holes of a circuit board for the next soldering operation. This process must be achieved economically both in time, and in combating wear by preserving the cutting tools’ sharpness. The present study investigates the shearing action and subsequent fracture in cutting. Plastic analysis for both cutting and forming (clinching) is presented with the support of measured data obtained on a prototype machine employed in the research. Wear analysis of the cutting surfaces leads to a recognition of the role played by various geometric parameters such as lead shape, cutter and anvil angles, cutter and anvil distance, etc.
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Mechanical Study for the Cutting and Clinching Process of Electronic Component Leads
P. A. Engel,
P. A. Engel
State University of New York at Binghamton, Binghamton, NY 13902
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Kee Rong Wu,
Kee Rong Wu
State University of New York at Binghamton, Binghamton, NY 13902
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Xuejun Zhai,
Xuejun Zhai
State University of New York at Binghamton, Binghamton, NY 13902
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Stan Janisiewicz
Stan Janisiewicz
Universal Instruments Co., Binghamton, NY 13905
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P. A. Engel
State University of New York at Binghamton, Binghamton, NY 13902
Kee Rong Wu
State University of New York at Binghamton, Binghamton, NY 13902
Xuejun Zhai
State University of New York at Binghamton, Binghamton, NY 13902
Stan Janisiewicz
Universal Instruments Co., Binghamton, NY 13905
J. Manuf. Sci. Eng. May 1998, 120(2): 279-286 (8 pages)
Published Online: May 1, 1998
Article history
Received:
May 1, 1995
Revised:
December 1, 1995
Online:
January 17, 2008
Citation
Engel, P. A., Wu, K. R., Zhai, X., and Janisiewicz, S. (May 1, 1998). "Mechanical Study for the Cutting and Clinching Process of Electronic Component Leads." ASME. J. Manuf. Sci. Eng. May 1998; 120(2): 279–286. https://doi.org/10.1115/1.2830125
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