For bulk acoustic wave quartz resonators, the central resonant frequency is inversely proportional to the wafer thickness. The tolerance of the resonant frequency is directly proportional to the total thickness variation of the quartz wafer. To increase the operating frequency while preserving a high tolerance on frequency, thinner quartz wafers with better thickness tolerances are needed. This paper describes the design and implementation of a precision grinding apparatus capable of producing ultra-thin quartz wafers to better thickness tolerances than previously achieved. A distributed-stress fixturing method that permits machining of ultra-thin, brittle substrates is described. The machine’s precision has been achieved through a high stiffness structural loop and real-time position feedback control. Optical interferometry is used in a new technique to measure thickness variation over the entire wafer. This research will enable production of quartz crystal oscillators with higher frequencies and better quality for the resonator industry.
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August 1993
This article was originally published in
Journal of Engineering for Industry
Research Papers
Precision Grinding of Ultra-Thin Quartz Wafers
T. G. Bifano,
T. G. Bifano
Precision Engineering Laboratory, Aerospace and Mechanical Engineering Department, Boston University, Boston, MA 02215
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J. B. Hosler
J. B. Hosler
Precision Engineering Laboratory, Aerospace and Mechanical Engineering Department, Boston University, Boston, MA 02215
Search for other works by this author on:
T. G. Bifano
Precision Engineering Laboratory, Aerospace and Mechanical Engineering Department, Boston University, Boston, MA 02215
J. B. Hosler
Precision Engineering Laboratory, Aerospace and Mechanical Engineering Department, Boston University, Boston, MA 02215
J. Eng. Ind. Aug 1993, 115(3): 258-262
Published Online: August 1, 1993
Article history
Received:
July 1, 1992
Online:
April 8, 2008
Citation
Bifano, T. G., and Hosler, J. B. (August 1, 1993). "Precision Grinding of Ultra-Thin Quartz Wafers." ASME. J. Eng. Ind. August 1993; 115(3): 258–262. https://doi.org/10.1115/1.2901658
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