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Keywords: thermal boundary conductance
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Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. September 2014, 136(9): 092401.
Paper No: HT-13-1565
Published Online: June 12, 2014
... for the electron–phonon thermal boundary conductance at metal/insulator interfaces increases with electron temperature. Our approach demonstrates that the metal-electron/nonmetal phonon conductance at interfaces can be an order of magnitude larger than purely phonon driven processes when the electrons are driven...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. June 2013, 135(6): 061301.
Paper No: HT-12-1531
Published Online: May 16, 2013
.... The results lead to their design to realize desired thermophysical properties and functions. lipid bilayer thermal energy transfer thermal conductivity thermal boundary conductance nonequilibrium molecular dynamics Soft matter, condensed matter that is easily deformed at room temperature...
Journal Articles
Publisher: ASME
Article Type: Heat Transfer In Nanochannels, Microchannels, And Minichannels
J. Heat Mass Transfer. February 2012, 134(2): 020910.
Published Online: December 22, 2011
... conduction phonons thermal conductivity thermoreflectance thin films pump-probe thermoreflectance thermal boundary conductance graphite diffuse mismatch model anisotropy Allotropes of carbon often exhibit extreme material properties due to the strong covalent bonds between atoms...
Journal Articles
Publisher: ASME
Article Type: Technical Briefs
J. Heat Mass Transfer. July 2011, 133(7): 074501.
Published Online: April 4, 2011
...John C. Duda; Pamela M. Norris; Patrick E. Hopkins We present a new model for predicting thermal boundary conductance in the classical limit. This model takes a different form than those of the traditionally used mismatch theories in the fact that the temperature dependence of thermal boundary...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. June 2011, 133(6): 062401.
Published Online: March 9, 2011
... understanding of the processes affecting interfacial thermal transport, as characterized by the thermal boundary conductance. When thermal boundary conductance is driven by phononic scattering events, accurate predictions of interfacial transport must account for anharmonic phononic coupling as this affects...
Journal Articles
Patrick E. Hopkins, Justin R. Serrano, Leslie M. Phinney, Sean P. Kearney, Thomas W. Grasser, C. Thomas Harris
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. August 2010, 132(8): 081302.
Published Online: May 20, 2010
... Hopkins , P. E. , Norris , P. M. , Stevens , R. J. , Beechem , T. , and Graham , S. , 2008 , “ Influence of Interfacial Mixing on Thermal Boundary Conductance Across a Chromium/Silicon Interface ,” ASME J. Heat Transfer 0022-1481 , 130 , p. 062402 . 10.1115/1.2897344...
Journal Articles
Publisher: ASME
Article Type: Micro/Nanoscale Heat Transfer—Part Ii
J. Heat Mass Transfer. April 2009, 131(4): 043207.
Published Online: February 20, 2009
... and experiments concerning phonon scattering processes driving thermal boundary conductance ( h B D ) are reviewed. Experimental studies of thermal boundary conductance conducted with the transient thermoreflectance technique challenging specific assumptions about phonon scattering during thermal boundary...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. February 2009, 131(2): 022402.
Published Online: January 5, 2009
...Patrick E. Hopkins; Pamela M. Norris The accuracy of predictions of phonon thermal boundary conductance using traditional models such as the diffuse mismatch model (DMM) varies depending on the types of material comprising the interface. The DMM assumes that phonons, undergoing diffuse scattering...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. June 2008, 130(6): 062402.
Published Online: April 23, 2008
... deposition conditions to control the growth around the Cr ∕ Si boundary. The Cr ∕ Si interfaces are characterized with Auger electron spectroscopy. The thermal boundary conductance ( h BD ) is measured with the transient thermoreflectance technique. Values of h BD are found to vary with both the thickness...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. February 2008, 130(2): 022401.
Published Online: February 4, 2008
...Patrick E. Hopkins; Pamela M. Norris; Robert J. Stevens Thermal boundary conductance is becoming increasingly important in microelectronic device design and thermal management. Although there has been much success in predicting and modeling thermal boundary conductance at low temperatures...