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Keywords: micromechanical devices
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Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. March 2012, 134(3): 031008.
Published Online: January 13, 2012
... analysis heat transfer micromechanical devices optimisation transport processes 25 08 2010 23 05 2011 13 01 2012 13 01 2012 Total cooling energy consumption of adaptable and traditional designs for 9 years [( 50 )]. Cross signs show that the reliability requirement...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. October 2011, 133(10): 101502.
Published Online: August 11, 2011
... as they have the potential to handle very high heat fluxes and offer effective thermal conductivities exceeding that of diamond. heat pipe electronic cooling evaporation cooling copper electrodeposition finite element analysis heat pipes micromechanical devices nanofabrication...
Journal Articles
Publisher: ASME
Article Type: Guest Editorial
J. Heat Mass Transfer. June 2011, 133(6): 060301.
Published Online: March 7, 2011
...Yogendra Joshi; Mohamed-Nabil Sabry 07 03 2011 07 03 2011 convection cooling foams heat sinks microfabrication micromechanical devices two-phase flow This special issue of the Journal of Heat Transfer contains six papers selected out of the 53 presented at the Second...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. November 2010, 132(11): 111801.
Published Online: August 10, 2010
... include the axial length, temperature range, mass flow rate, and working fluid. 04 02 2009 01 10 2009 10 08 2010 10 08 2010 cryogenics flow through porous media heat exchangers heat transfer micromechanical devices plates (structures) perforated plate heat exchanger...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. May 2010, 132(5): 052403.
Published Online: March 9, 2010
.../j.ijheatmasstransfer.2007.01.052 19 06 2009 23 09 2009 09 03 2010 09 03 2010 annealing capillarity carbon nanotubes cooling micromechanical devices temperature measurement thermal management (packaging) thermometers thermometer carbon nanotube wick structure...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. November 2009, 131(11): 111402.
Published Online: August 26, 2009
... 2009 26 08 2009 heat transfer jets micromechanical devices orifices (mechanical) electronics cooling microscale jet heat transfer microjet orifice pressure loss coefficient Due to the increasing power consumption and decreasing size of electronic chips, cooling...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. May 2009, 131(5): 052401.
Published Online: March 16, 2009
... apparent thermal conductivity than a silica aerogel, which has an apparent thermal conductivity of 0.03   W / m   K when the cold-side temperature is 294 K ( 5 ). micro-insulation MEMS microscale cells (electric) heat conduction insulation micromechanical devices...
Journal Articles
Publisher: ASME
Article Type: Micro/Nanoscale Heat Transfer—Part Ii
J. Heat Mass Transfer. April 2009, 131(4): 043201.
Published Online: February 11, 2009
... between the two measurements, which arise from the geometry of the test structures and electrical contacts, are explained by bond pad heating and thermal resistance effects. 27 03 2008 09 12 2008 11 02 2009 micromechanical devices silicon thermal conductivity thermal...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. September 2008, 130(9): 091601.
Published Online: July 3, 2008
... thermocouple microhotplate calibration contact resistance micromechanical devices probes thermal conductivity thermal conductivity measurement thermal resistance thermal resistance measurement thermocouples 26 03 2007 13 11 2007 03 07 2008 The authors thank...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. April 2008, 130(4): 042403.
Published Online: March 17, 2008
... 2008 cooling diffusion evaporation flow through porous media heat transfer latent heat mass transfer membranes microfluidics micromechanical devices polymers supports microtruss architecture latent heat transfer mass transfer pore diffusion MEMS nanotechnology membrane...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. February 2008, 130(2): 022401.
Published Online: February 4, 2008
...-phonon processes in thermal boundary conductance at high temperatures. alumina aluminium chromium dielectric materials interface phonons micromechanical devices phonon-phonon interactions platinum silicon thermal conductivity thermoreflectance thermal boundary conductance diffuse...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Heat Mass Transfer. July 2007, 129(7): 798–804.
Published Online: August 14, 2006
... 6 7 8 ). micro-column arrays emissivity blackbody spectrum space thermal analysis micromechanical devices temperature control aerospace components lightweight structures temperature distribution laser materials processing surface treatment emissivity finite element...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Heat Mass Transfer. June 2004, 126(3): 453–462.
Published Online: June 16, 2004
... evaporation heat pipes LIGA cooling channel flow micromechanical devices gravity lithography electrodeposition Channel Flow Evaporation Heat Transfer Heat Pipes Microscale Evaporative cooling devices such as heat pipes and capillary pumped loops utilize capillary suction to draw...
Journal Articles
Publisher: ASME
Article Type: Review Papers
J. Heat Mass Transfer. April 2002, 124(2): 223–241.
Published Online: December 7, 2001
... micromechanical devices integrated circuits optoelectronic devices Conduction Heat Transfer Interface Measurement Techniques Microscale Nanoscale Thin Films The last 50 years have witnessed the transformation of solid-state devices from objects of mere scientific curiosity to being...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Heat Mass Transfer. April 2002, 124(2): 375–382.
Published Online: October 18, 2001
... the transient bubble nucleation behavior in the micro-scale and compared with experimental measurements. 26 April 2001 18 October 2001 silicon bubbles resistors micromechanical devices integrated circuit packaging Bubble Growth Heat Transfer Microscale Phase Change Transient...
Journal Articles
Publisher: ASME
Article Type: Technical Notes
J. Heat Mass Transfer. April 2002, 124(2): 394–396.
Published Online: August 6, 2001
... August 6, 2001. Associate Editor: A. Majumdar. 18 December 2000 06 August 2001 adhesion micromechanical devices laser beam applications high-speed optical techniques maintenance engineering stiction Experimental Laser Microscale Microstructures Surface Adhesion...