... integrated circuit interconnections integrated circuit packaging microchannel flow microprocessor chips refrigerants thermal management (packaging) two-phase flow 02 02 2009 25 09 2009 19 02 2010 19 02 2010 2010 American Society of Mechanical Engineers ...

... sinks are provided. 11 04 2006 23 02 2007 cooling heat sinks heat transfer integrated circuit packaging thermal management (packaging) conjugate heat transfer thermal management microelectronics micro-fabrication microchannel liquid cooling Heat removal has...

.... dissertation, Purdue University, West Lafayette, IN. 11 08 2005 13 03 2006 dielectric liquids boiling graphite undercooling porous materials copper bubbles thermal management (packaging) integrated circuit packaging Advanced cooling methods and techniques are being...

... refrigerants heat exchangers thermoelectric devices integrated circuit packaging 26 06 2005 07 02 2006 Heat flux calibration table (points are shown in Fig. 6 ) Sensor output (uncertainty 3%) (mv) 1 Power output (uncertainty 3%) ( W ∕ cm 2 ) Input from...

... sensors integrated circuit packaging valves With the increased use of complementary metal-oxide-semiconductor (CMOS) chip technologies in today’s computers, cooling has now become a strong influence on computer performance 1 . Electron and hole mobility is the primary electrical property...

... circuit packaging cooling sensors mechanical contact With the strong move towards complementary metal-oxide-semiconductor (CMOS) chip technologies, cooling has now become a strong influence on computer performance 1 . It is known that mobility, which is a ratio of electron or hole velocities...

... temperature range from zero to a hundred hertz or so. conduction control electronics heat transfer temperature temperature control distributed parameter systems integrated circuit testing integrated circuit packaging thermal management (packaging) 04 08 2004 10 02 2005...

... 01 2003 thermal variables control temperature control distributed parameter systems integrated circuit design integrated circuit packaging Conduction Control Electronics Heat Transfer Temperature All high-performance electronic devices are subject to a 100 percent...

... the transient bubble nucleation behavior in the micro-scale and compared with experimental measurements. 26 April 2001 18 October 2001 silicon bubbles resistors micromechanical devices integrated circuit packaging Bubble Growth Heat Transfer Microscale Phase Change Transient...

... . Manuscript received by the Heat Transfer Division April 30, 2001; revision received August 21, 2001. Associate Editor: G. P. Peterson. 30 April 2001 21 August 2001 boiling organic compounds cooling heat transfer rough surfaces monolithic integrated circuits integrated circuit...