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Keywords: Thermal Packing
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Journal Articles

Elastoplastic Contact Conductance Model for Isotropic Conforming Rough Surfaces and Comparison With Experiments

M. R. Sridhar, M. M. Yovanovich
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. February 1996, 118(1): 3–9.
https://doi.org/10.1115/1.2824065
Published Online: February 1, 1996
... by the Heat Transfer Division May 1994; revision received January 1995. Keywords: Conduction, Electronic Equipment, Thermal Packing. Associate Technical Editor: L. S. Fletcher. faces using the recently proposed elastoplastic model for sphere- flat contacts and then reduce experimental data (Antonetti, 1983...
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Topics: Electrical conductance, Surface roughness, Deformation, Contact resistance, Electronic equipment, Heat conduction, Materials properties, Packing (Shipments), Packings (Cushioning)