... ), pp. 579 – 591 . 10.1080/01457632.2020.1716482 [11] Colla , L. , Ercole , D. , Fedele , L. , Mancin , S. , Manca , O. , and Bobbo , S. , 2017 , “ Nano-Phase Change Materials for Electronics Cooling Applications ,” ASME J. Heat Mass Transfer-Trans...

... heat transfer coefficient electronic cooling The development of efficient heat exchangers is imperative in addressing the challenge of increased levels of heat flux dissipation in high-performance miniature electronic devices. High-porosity metal foams (MFs) have emerged as highly efficient...

... for a variety of applications including electronics cooling. In this work, advanced heat management devices are designed and numerically studied employing single and multijet impingement through porous-filled channels with inclined walls. The base of these porous-filled nonuniform heat exchanging channels...

... heat sinks in electronics cooling, numerous investigations have been conducted on convection heat transfer in microchannels [ 3 ]. Recent advance in the microfabrication technology have enabled realization of the enhanced microchannels. Micro-pin-fin heat sinks have received the most attention among...

... for publication in the J OURNAL OF H EAT T RANSFER . Manuscript received August 2, 2017; final manuscript received June 28, 2018; published online August 3, 2018. Assoc. Editor: Debjyoti Banerjee. 02 08 2017 28 06 2018 Electronic cooling Energy systems Melting Melting Freezing...

... dynamics Electronic cooling Experimental techniques Heat and mass transfer Owing to their high efficiency, electrical machines are widely used in various industrial applications such as motors for automobiles, trains, electrical production in nuclear plants, and wind generators. However, because...

... Transfer Division of ASME for publication in the J OURNAL OF H EAT T RANSFER . Manuscript received June 10, 2017; final manuscript received March 28, 2018; published online July 23, 2018. Assoc. Editor: Thomas Beechem. 10 06 2017 28 03 2018 Electronic cooling Evaporation Heat...

... No.: NPRP 6-1304-2-525. *Corresponding author: jorge.alvarado@tamu.edu Experimental Angled View S = 0.65 mm S = 1.2 mm S = 2 mm Numerical Side View Experimental Side View Bubbles Computational fluid dynamics Electronic cooling Experimental techniques Jets Wakes Impingement Cooling Particles...

... in a partially porous cavity [ 6 ]. Their results show that the insertion of a vertical solid partition reduces significantly the net heat transfer rate through the layer. Computational fluid dynamics Conduction Electronic cooling Energy systems Heat exchangers Heat transfer enhancement Natural...

... April 19, 2018; published online June 8, 2018. Assoc. Editor: George S. Dulikravich. 23 01 2018 19 04 2018 Conduction Electronic cooling Thermophysical properties An integrated circuit's junction (or channel) temperature is a key parameter affecting both its performance...

... 2016 26 04 2018 Electronic cooling Extended surfaces Natural convection Thermal systems Mixed convection Heat is produced as a by-product during the normal operation from the electronic equipment. Miniaturization of these devices introduces enhanced power dissipation...

... for publication in the J OURNAL OF H EAT T RANSFER . Manuscript received April 19, 2017; final manuscript received April 21, 2018; published online May 25, 2018. Assoc. Editor: Thomas Beechem. 19 04 2017 21 04 2018 Aerospace Electronic cooling Extended surfaces Heat exchangers Heat...

... optimization. 23 01 2018 20 04 2018 Conduction Electronic cooling Forced convection Heat and mass transfer In electronic devices such as computer processors and integrated circuits, the heating density is often large and is restricting the maximum computational power. Typically...

...; final manuscript received March 22, 2018; published online May 22, 2018. Assoc. Editor: Zhixiong Guo. 23 10 2017 22 03 2018 Electronic cooling Natural convection Radiative heat transfer Mixed convection The interaction between thermal radiation and natural convection...

... OF H EAT T RANSFER . Manuscript received April 24, 2017; final manuscript received October 29, 2017; published online April 6, 2018. Assoc. Editor: Alan McGaughey. 24 04 2017 29 10 2017 Conduction Electronic cooling Thermal management is considered as a key factor...

... measured along the horizontal and the vertical walls of the cavity, respectively, u and v are the velocity components along the x - and y -axes, respectively, T is the fluid temperature, p is the fluid pressure, g is the gravity acceleration. Electronic cooling Heat transfer enhancement...

... manuscript received January 18, 2018; published online March 9, 2018. Assoc. Editor: George S. Dulikravich. 05 07 2017 18 01 2018 Computational fluid dynamics Electronic cooling Forced convection Heat transfer enhancement Micro heat transfer Nanoscale heat transfer A sessile...

..., 2017; final manuscript received October 16, 2017; published online January 30, 2018. Assoc. Editor: Ali Khounsary. 30 05 2017 16 10 2017 Electronic cooling Heat exchangers Micro heat transfer Nanoscale heat transfer Flow networks are characterized by a plurality...

... 13, 2017; published online January 30, 2018. Assoc. Editor: Zhixiong Guo. 30 03 2017 13 09 2017 Electronic cooling Natural convection Thermophysical properties Mixed convection Natural convection plays an important role in the cooling of electrical and electronic...

..., and their geometrical compatibility with proposed PIC packages. Electronic cooling Forced convection Heat and mass transfer Heat transfer enhancement Jets Wakes Impingement Cooling 22 02 2017 10 07 2017 Contributed by the Heat Transfer Division of ASME for publication in the J OURNAL...