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Journal Articles

Thermal Design of an Airborne Computer Chassis With Air-Cooled, Cast Pin Fin Coldwalls

Donald C. Price, Life Fellow, ASME Principal Fellow,, B. Elliott Short,, Jr., Mem., ASME Senior Principal Mechanical Engineer,

Publisher: ASME

J. Heat Mass Transfer. January 2005, 127(1): 11–17.

https://doi.org/10.1115/1.1839583

Published Online: February 15, 2005

View Article titled, Thermal Design of an Airborne Computer Chassis With Air-Cooled, Cast Pin Fin Coldwalls

Topics: Computers, Design, Flow (Dynamics), Printed circuit boards, Temperature, Thermal management, Cooling, Electronics, Flight

Journal Articles

A Multi-Grid Based Multi-Scale Thermal Analysis Approach for Combined Mixed Convection, Conduction, and Radiation Due to Discrete Heating

Lan Tang, Yogendra K. Joshi

Publisher: ASME

J. Heat Mass Transfer. January 2005, 127(1): 18–26.

https://doi.org/10.1115/1.1852495

Published Online: February 15, 2005

View Article titled, A Multi-Grid Based Multi-Scale Thermal Analysis Approach for Combined Mixed Convection, Conduction, and Radiation Due to Discrete Heating

Topics: Flow (Dynamics), Forced convection, Heat, Heat conduction, Junctions, Mixed convection, Modeling, Printed circuit boards, Temperature, Thermal analysis

Journal Articles

Thermal Conductivity Measurements in Printed Wiring Boards

J. E. Graebner, K. Azar

Publisher: ASME

J. Heat Mass Transfer. August 1997, 119(3): 401–405.

https://doi.org/10.1115/1.2824111

Published Online: August 1, 1997

View Article titled, Thermal Conductivity Measurements in Printed Wiring Boards

Topics: Printed circuit boards, Thermal conductivity, Copper, Epoxy adhesives, Epoxy resins, Glass, Anisotropy, Lumber, Heat, Heat conduction

Journal Articles

A Correlation for Heat Transfer and Wake Effect in the Entrance Region of an In-Line Array of Rectangular Blocks Simulating Electronic Components

M. Molki, M. Faghri, O. Ozbay

Publisher: ASME

J. Heat Mass Transfer. February 1995, 117(1): 40–46.

https://doi.org/10.1115/1.2822320

Published Online: February 1, 1995

View Article titled, A Correlation for Heat Transfer and Wake Effect in the Entrance Region of an In-Line Array of Rectangular Blocks Simulating Electronic Components

Topics: Electronic components, Entrance region, Heat transfer, Wakes, Fluids, Heat transfer coefficients, Temperature, Computers, Electronic equipment, Engineers

Journal Articles

Impingement Cooling of Electronics

B. R. Hollworth, M. Durbin

Publisher: ASME

J. Heat Mass Transfer. August 1992, 114(3): 607–613.

https://doi.org/10.1115/1.2911324

Published Online: August 1, 1992

View Article titled, Impingement Cooling of Electronics

Topics: Air jets, Convection, Electronic equipment, Electronic packages, Electronics, Fluids, Geometry, Heat transfer, Impingement cooling, Jets

Journal Articles

Natural Convection Heat Transfer Characteristics of Simulated Microelectronic Chips

K.-A. Park, A. E. Bergles

Publisher: ASME

J. Heat Mass Transfer. February 1987, 109(1): 90–96.

https://doi.org/10.1115/1.3248074

Published Online: February 1, 1987

View Article titled, Natural Convection Heat Transfer Characteristics of Simulated Microelectronic Chips

Topics: Boundary layers, Circuits, Heat transfer, Heat transfer coefficients, Natural convection, Printed circuit boards, Water

Journal Articles

Thermosyphon Boiling in Vertical Channels

A. Bar-Cohen, H. Schweitzer

Publisher: ASME

J. Heat Mass Transfer. November 1985, 107(4): 772–778.

https://doi.org/10.1115/1.3247503

Published Online: November 1, 1985

View Article titled, Thermosyphon Boiling in Vertical Channels

Topics: Boiling, Heat transfer, Heat flux, Ceramics, Cooling, Cooling systems, Flow (Dynamics), Integrated circuits, Plates (structures), Pool boiling

Journal citation

NARROW

Thermal Design of an Airborne Computer Chassis With Air-Cooled, Cast Pin Fin Coldwalls

A Multi-Grid Based Multi-Scale Thermal Analysis Approach for Combined Mixed Convection, Conduction, and Radiation Due to Discrete Heating

Thermal Conductivity Measurements in Printed Wiring Boards

A Correlation for Heat Transfer and Wake Effect in the Entrance Region of an In-Line Array of Rectangular Blocks Simulating Electronic Components

Impingement Cooling of Electronics

Natural Convection Heat Transfer Characteristics of Simulated Microelectronic Chips

Thermosyphon Boiling in Vertical Channels

ASME Journals

ASME Conference Proceedings

ASME eBooks

Resources

Opportunities

Thermal Design of an Airborne Computer Chassis With Air-Cooled, Cast Pin Fin Coldwalls

A Multi-Grid Based Multi-Scale Thermal Analysis Approach for Combined Mixed Convection, Conduction, and Radiation Due to Discrete Heating

Thermal Conductivity Measurements in Printed Wiring Boards

A Correlation for Heat Transfer and Wake Effect in the Entrance Region of an In-Line Array of Rectangular Blocks Simulating Electronic Components

Impingement Cooling of Electronics

Natural Convection Heat Transfer Characteristics of Simulated Microelectronic Chips

Thermosyphon Boiling in Vertical Channels

ASME Journals

ASME Conference Proceedings

ASME eBooks

Resources

Opportunities

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