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Journal Articles

Parametric Analysis of Microfluidic Cooling Systems for Three-Dimensional-Stacked Silicon Microelectronics by Inferential Statistic Approaches

Tomas Moreno-Torres, Daniel Lorenzini, Yogendra Joshi, Abel Hernandez-Guerrero, J. Luis Luviano-Ortiz

Publisher: ASME

J. Heat Mass Transfer. April 2021, 143(4): 044502.

Paper No: HT-20-1769

https://doi.org/10.1115/1.4049639

Published Online: February 2, 2021

View Article titled, Parametric Analysis of Microfluidic Cooling Systems for Three-Dimensional-Stacked Silicon Microelectronics by Inferential Statistic Approaches

Topics: Computer simulation, Cooling systems, Density, Experimental design, Heat, Microfluidics, Pressure drop, Silicon, Temperature, Fins

Journal Articles

Liquid Flow Forced Convection in Rectangular Microchannels With Nonuniform Heating: Toward Analytical Modeling of Hotspots

Milad Azari, Arman Sadeghi, Morteza Dejam

Publisher: ASME

J. Heat Mass Transfer. August 2020, 142(8): 082505.

Paper No: HT-19-1292

https://doi.org/10.1115/1.4047148

Published Online: June 23, 2020

View Article titled, Liquid Flow Forced Convection in Rectangular Microchannels With Nonuniform Heating: Toward Analytical Modeling of Hotspots

Topics: Flow (Dynamics), Heat, Heat flux, Heating, Microchannels, Modeling, Osmosis, Pressure, Temperature, Electroosmosis

Journal Articles

Transient Heat Conduction in On-Chip Interconnects Using Proper Orthogonal Decomposition Method

Banafsheh Barabadi, Satish Kumar, Yogendra K. Joshi

Publisher: ASME

J. Heat Mass Transfer. July 2017, 139(7): 072101.

Paper No: HT-13-1223

https://doi.org/10.1115/1.4035889

Published Online: March 21, 2017

View Article titled, Transient Heat Conduction in On-Chip Interconnects Using Proper Orthogonal Decomposition Method

Topics: Heat, Heating, Joules, Principal component analysis, Temperature, Transient heat transfer, Transients (Dynamics), Simulation, Microelectronic devices

Journal Articles

Thermal wave imaging of microelectronics

Miguel Goni, Aaron J. Schmidt

Publisher: ASME

J. Heat Mass Transfer. February 2016, 138(2): 020911.

Paper No: HT-15-1717

https://doi.org/10.1115/1.4032255

Published Online: January 18, 2016

View Article titled, Thermal wave imaging of microelectronics

Topics: Imaging, Microelectronic devices, Waves, Thermal properties, Electrodes, Glass, Lasers, Temperature, Wave frequency, Wire

Journal Articles

Experimental and Numerical Study of a Stacked Microchannel Heat Sink for Liquid Cooling of Microelectronic Devices

Xiaojin Wei, Yogendra Joshi, Michael K. Patterson

Publisher: ASME

J. Heat Mass Transfer. October 2007, 129(10): 1432–1444.

https://doi.org/10.1115/1.2754781

Published Online: February 23, 2007

View Article titled, Experimental and Numerical Study of a Stacked Microchannel Heat Sink for Liquid Cooling of Microelectronic Devices

Topics: Cooling, Flow (Dynamics), Heat sinks, Heat transfer, Heating, Microchannels, Temperature, Microelectronic devices, Heat, Wall temperature

Journal Articles

Foreword

A. Majumdar, G. P. Peterson, D. Poulikakos

Publisher: ASME

J. Heat Mass Transfer. April 2002, 124(2): 221–222.

https://doi.org/10.1115/1.1464566

Published Online: April 1, 2002

View Article titled, Foreword

Topics: Heat, Heat transfer, Mass transfer, Nanoscale phenomena, Nanotechnology, Microelectronic devices

Journal Articles

Two-Phase Heat Dissipation Utilizing Porous-Channels of High-Conductivity Material

G. P. Peterson, C. S. Chang

Publisher: ASME

J. Heat Mass Transfer. February 1998, 120(1): 243–252.

https://doi.org/10.1115/1.2830048

Published Online: February 1, 1998

View Article titled, Two-Phase Heat Dissipation Utilizing Porous-Channels of High-Conductivity Material

Topics: Energy dissipation, Flow (Dynamics), Heat, Thermal conductivity, Copper, Fluids, Heat sinks, Particulate matter, Subcooling, Water

Journal Articles

Significant Questions in Thin Liquid Film Heat Transfer

S. G. Bankoff

Publisher: ASME

J. Heat Mass Transfer. February 1994, 116(1): 10–16.

https://doi.org/10.1115/1.2910843

Published Online: February 1, 1994

View Article titled, Significant Questions in Thin Liquid Film Heat Transfer

Topics: Heat transfer, Lubrication theory, Thin films, Rupture, Cooling, Blades, Boiling, Bubbles, Evaporation, Flow (Dynamics)

Journal Articles

Recent Developments in Contact Conductance Heat Transfer

L. S. Fletcher

Publisher: ASME

J. Heat Mass Transfer. November 1988, 110(4b): 1059–1070.

https://doi.org/10.1115/1.3250610

Published Online: November 1, 1988

View Article titled, Recent Developments in Contact Conductance Heat Transfer

Topics: Electrical conductance, Heat transfer, Biomedicine, Contact resistance, Heat conduction, Microelectronic devices, Thermal conductivity, Thermal rectification

Journal citation

NARROW

Parametric Analysis of Microfluidic Cooling Systems for Three-Dimensional-Stacked Silicon Microelectronics by Inferential Statistic Approaches

Liquid Flow Forced Convection in Rectangular Microchannels With Nonuniform Heating: Toward Analytical Modeling of Hotspots

Transient Heat Conduction in On-Chip Interconnects Using Proper Orthogonal Decomposition Method

Thermal wave imaging of microelectronics

Experimental and Numerical Study of a Stacked Microchannel Heat Sink for Liquid Cooling of Microelectronic Devices

Foreword

Two-Phase Heat Dissipation Utilizing Porous-Channels of High-Conductivity Material

Significant Questions in Thin Liquid Film Heat Transfer

Recent Developments in Contact Conductance Heat Transfer

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