Presented here are the results of an experimental investigation of two ultrathin miniature loop heat pipes (mLHPs) with different internal wicking structures: one with a primary wicking structure in the evaporator and a secondary wicking structure in the liquid line, and the other only with the same primary wicking structure in the evaporator, but no secondary wick. The systematic experimental investigation was conducted using natural convection as the cooling mechanism in order to study the heat transfer performance of the two mLHPs and fully examine the effects of the secondary wick. The results indicated that both of the test articles could effectively dissipate 12 W at all test orientations with a minimum total thermal resistances of 6.38 °C/W and 6.39 °C/W, respectively. However, the results indicated that the presence of the secondary wicking structure in the liquid line at low power loads resulted in more stable startup characteristics and a weaker dependence on the different orientations. Moreover, it was demonstrated that the steady-state evaporator temperatures of the test article with the secondary wicking structure in the liquid line were much lower than those observed for a 1-mm thick copper plate with the same geometric dimensions for all heat loads in the horizontal orientation, showing a higher thermal performance.

References

1.
Gerasimov, Y. F., and Maydanik, Y. F.,
1974
, “
Heat Pipe
,” USSR Inventors Certificate No. 449213.
2.
Maydanik
,
Y. F.
,
2005
, “
Review: Loop Heat Pipes
,”
Appl. Therm. Eng.
,
25
(
5–6
), pp.
635
657
.
3.
Maydanik
,
Y. F.
,
Vershinin
,
S. V.
,
Korukov
,
M. A.
, and
Ochterbeck
,
J. M.
,
2005
, “
Miniature Loop Heat Pipes—A Promising Means for Cooling Electronics
,”
IEEE Trans. Compon. Packag. Technol.
,
28
(
2
), pp.
290
296
.
4.
Maydanik
,
Y. F.
,
Fershtater
,
Y. G.
, and
Goncharov
,
K. A.
,
1997
, “
Capillary-Pump Loop for the Thermal Regulation of Spacecraft
,”
Sixth European Symposium on Space Environmental Control Systems
, Noordwijk, The Netherlands, May 20–22, pp.
341
353
.
5.
Goncharov
,
K.
, and
Kolesnikov
,
V.
,
2002
, “
Development of Propylene LHP for Spacecraft Thermal Control Systems
,”
12th International Heat Pipe Conference
, Moscow, Russia, May 19–24, pp.
171
176
.
6.
Goncharov
,
K. A.
,
Nikitkin
,
M. N.
,
Golovin
,
O. A.
, and
Piukov
,
S. A.
,
1995
, “
Loop Heat Pipes in Thermal Control Systems for “OBZOR” Spacecraft
,”
SAE
Technical Paper No. 951555.
7.
Li
,
J.
,
Wang
,
D. M.
, and
Peterson
,
G. P.
,
2011
, “
A Compact Loop Heat Pipe With Flat Square Evaporator for High Power Chip Cooling
,”
IEEE Trans. Compon. Packag. Manuf. Technol.
,
1
(
4
), pp.
519
527
.
8.
Launay
,
S.
,
Sartre
,
V.
, and
Bonjour
,
J.
,
2007
, “
Parametric Analysis of Loop Heat Pipes Operation: A Literature Review
,”
Int. J. Therm. Sci.
,
46
(
7
), pp.
621
636
.
9.
Ku
,
J.
,
1999
, “
Operating Characteristics of Loop Heat Pipes
,”
SAE
Technical Paper No. 1999-01-2007.
10.
Dickey
,
T.
, and
Peterson
,
G. P.
,
1994
, “
An Experimental and Analytical Investigation of the Operational Characteristics of a CPL
,”
AIAA J. Thermophys. Heat Transfer
,
8
(
3
), pp.
602
607
.
11.
Li
,
J.
, and
Peterson
,
G. P.
,
2011
, “
3D Heat Transfer Analysis in a Loop Heat Pipe Evaporator With a Fully Saturated Wick
,”
Int. J. Heat Mass Transfer
,
54
(
1–3
), pp.
564
574
.
12.
Liu
,
Z. C.
,
Li
,
H.
, and
Chen
,
B. B.
,
2012
, “
Operational Characteristics of Flat Type Loop Heat Pipe With Biporous Wick
,”
Int. J. Therm. Sci.
,
58
(
4
), pp.
180
185
.
13.
Yeh
,
C. C.
,
Chen
,
C. N.
, and
Chen
,
Y. M.
,
2009
, “
Heat Transfer Analysis of a Loop Heat Pipe With Biporous Wicks
,”
Int. J. Heat Mass Transfer
,
52
(
19
), pp.
4426
4434
.
14.
Li
,
H.
,
Wang
,
X. G.
,
Liu
,
Z. S.
,
Tang
,
Y.
,
Yuan
,
W.
,
Zhou
,
R.
, and
Li
,
Y.
,
2015
, “
Experimental Investigation on the Sintered Wick of the Anti-Gravity Loop-Shaped Heat Pipe
,”
Exp. Therm. Fluid Sci.
,
68
(
4
), pp.
689
696
.
15.
Wang
,
Y. W.
,
Cen
,
J. W.
,
Jiang
,
F. M.
,
Cao
,
W. J.
, and
Guo
,
J.
,
2016
, “
LHP Heat Transfer Performance: A Comparison Study About Sintered Copper Powder Wick and Copper Mesh Wick
,”
Appl. Therm. Eng.
,
92
(
1
), pp.
104
110
.
16.
Shioga
,
T.
, and
Mizuno
,
Y.
,
2015
, “
Micro Loop Heat Pipe for Mobile Electronics Applications
,”
31st Thermal Measurement, Modeling & Management Symposium
(
SEMI-THERM
), San Jose, CA, Mar. 15–19, pp.
50
55
.
17.
Zhou
,
G. H.
,
Li
,
J.
, and
Lv
,
L. C.
,
2016
, “
An Ultra-Thin Loop Heat Pipe Cooler for Mobile Electronics
,”
Appl. Therm. Eng.
,
109
(
Part A
), pp.
514
523
.
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