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November 1988
This article was originally published in
Journal of Heat Transfer
Technical Briefs
Evaluation of Thermal Contact Conductance Between Mold Compound and Heat Spreader Materials
G. P. Peterson,
G. P. Peterson
Mechanical Engineering Department, Texas A&M University, College Station, TX 77843
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L. S. Fletcher
L. S. Fletcher
Mechanical Engineering Department, Texas A&M University, College Station, TX 77843
Search for other works by this author on:
G. P. Peterson
Mechanical Engineering Department, Texas A&M University, College Station, TX 77843
L. S. Fletcher
Mechanical Engineering Department, Texas A&M University, College Station, TX 77843
J. Heat Transfer. Nov 1988, 110(4a): 996-999 (4 pages)
Published Online: November 1, 1988
Article history
Received:
April 27, 1987
Online:
October 20, 2009
Citation
Peterson, G. P., and Fletcher, L. S. (November 1, 1988). "Evaluation of Thermal Contact Conductance Between Mold Compound and Heat Spreader Materials." ASME. J. Heat Transfer. November 1988; 110(4a): 996–999. https://doi.org/10.1115/1.3250605
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