1-12 of 12
Keywords: two-phase flow
Close
Follow your search
Access your saved searches in your account

Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2021, 143(4): 041107.
Paper No: EP-21-1114
Published Online: October 14, 2021
... unexplored. In this study, a two-phase flow distribution model is used to investigate the impact of uneven heating on the flow distribution behavior of parallel microchannels undergoing boiling. Under lateral uneven heating (i.e., the channels are each heated to different levels, but the power input...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. March 2010, 132(1): 014502.
Published Online: March 4, 2010
... a complex molding compound flow behavior with multiple microchips in a single cavity. The developed numerical algorithm is based on the finite difference method combined with the robustness of volume of fluid volume-tracking method to solve the two-phase flow field in complex mold and die geometries. Twelve...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2009, 131(3): 031008.
Published Online: July 2, 2009
...Jaeseon Lee; Issam Mudawar This study examines the pressure drop characteristics of subcooled two-phase microchannel heat sinks. A new model is proposed, which depicts the subcooled flow as consisting of a homogeneous two-phase flow layer near the heated walls of the microchannel and a second...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2009, 131(2): 021010.
Published Online: April 3, 2009
...Christopher A. Konishi; Weilin Qu; Frank E. Pfefferkorn This study concerns pressure drop of adiabatic water liquid-vapor two-phase flow across an array of 1950 staggered square micropin-fins having a 200 × 200 μ m cross section by 670 μ m height. The ratios of longitudinal pitch and transverse...
Journal Articles
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. June 2009, 131(2): 024501.
Published Online: March 27, 2009
... when superheated. Normally the pressure gradient for two-phase flow is lower than that of vapor-phase flow at low quality region but is much larger at high quality region. Hence, the effective pressure gradient of the whole quality range may be a slightly higher than that of the single-phase (vapor...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2005, 127(4): 381–390.
Published Online: December 17, 2004
... procedure. 25 02 2004 17 12 2004 thermal management (packaging) heat sinks integrated circuit packaging two-phase flow microfluidics channel flow coolants Thermal engineers in the electronics industry are facing unprecedented challenges of removing enormous amounts of heat...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2004, 126(3): 317–324.
Published Online: October 6, 2004
... OF ELECTRONIC PACKAGING . Manuscript received Nov. 2003; final revision, Jan. 2004. Associate Editor: Guo-Quan Lu. 01 Nov 2003 01 Jan 2004 06 10 2004 cooling pipe flow condensation silicon boiling two-phase flow integrated circuit packaging Direct and indirect liquid...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2004, 126(2): 213–224.
Published Online: July 8, 2004
... coolant passages. This understanding is the primary goal of this paper. This goal is realized by exploring the following aspects of boiling in micro-channels: hydrodynamic instability, two-phase flow patterns, pressure drop, and convective boiling heat transfer. High-speed photographic methods were used...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2003, 125(3): 431–441.
Published Online: September 17, 2003
... cooling channel flow two-phase flow power semiconductor devices Several cooling schemes have been developed in recent years to combat the large increases in heat dissipation from electronic and power devices. Air-cooled heat sinks are presently found in most personal computers, but are rapidly...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2003, 125(2): 251–260.
Published Online: June 10, 2003
.... Culham. 12 October 2001 10 06 2003 heat pipes capillarity two-phase flow evaporation undercooling flow separation flow through porous media thermal conductivity pipe flow The control of operating temperature, regardless of power input, makes future use of CPL systems...