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Keywords: turbulence
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2009, 131(2): 021008.
Published Online: April 2, 2009
... experiencing turbulent flow. Predictive correlations are generated to ascertain the degree of enhancement based on the fluid’s thermophysical properties. The enhancement is quite small, suggesting the limited usefulness of nanofluids in this particular application. As is well known, most challenges...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2008, 130(3): 031011.
Published Online: August 5, 2008
...E. Elsaadawy; H. Mortazavi; M. S. Hamed Although the problem of 2D ribbed channels has been studied heavily in the literature as a benchmark or basic case for cooling of electronic packing, there is still a contradiction in the literature about the suitable turbulence model that should be used...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2007, 129(4): 400–410.
Published Online: December 28, 2006
... impingement have been successfully conducted. The fluid flow and heat transfer behavior explored includes the streamwise velocity and turbulence intensity distributions, transient dimensionless temperature distribution on the MCM disk surface, transient heat flux distribution of input power, and transient...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2007, 129(3): 247–255.
Published Online: December 13, 2006
.... A minichannel heat sink with bottom size of 20 mm × 20 mm is analyzed numerically for the single-phase turbulent flow of water as a coolant through small hydraulic diameters. A constant heat flux boundary condition is assumed. The effect of channel dimensions, channel wall thickness, bottom thickness, and inlet...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 465–471.
Published Online: January 24, 2005
... experiments are used for obtaining results for different flow rates and heat inputs, as these can often be varied more easily in experiments than in simulations. Also, transitional and turbulent flows are more accurately and more conveniently investigated experimentally. Thus, by using both approaches...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 501–509.
Published Online: January 24, 2005
... and more quickly reach good solutions. The theoretical and practical bases for h adiabatic are presented. Examples of its use in electronics cooling are described to show the operational advantages this approach offers. Turbulence strongly affects heat transfer. A simple, turbulence-based correlation...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 510–518.
Published Online: January 24, 2005
... Flotherm (trademark of Flomerics, Inc.). The flow was modeled using the k - e turbulence model. Results are displayed to provide some guidance on the design and layout of a data center. Manuscript received May 14, 2004; revision received October 5, 2004. Review conducted by: B. Sammakia. 14...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2004, 126(2): 213–224.
Published Online: July 8, 2004
... examined and deemed unsuitable for micro-channel heat sinks because all these correlations are based on turbulent flow assumptions, and do not capture the unique features of micro-channel flow such as abrupt transition to slug flow, hydrodynamic instability, and high droplet entrainment in the annular...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2000, 122(2): 107–114.
Published Online: October 1, 1999
... in the surrounding air. A simplified turbulence model is developed to predict temperatures in the low Re turbulence regime. A parametric study is performed to evaluate the effects of card design, air velocities, interconnect thermal conductivities and thermal radiation on the chip junction temperatures...