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Keywords: time-independent deformation
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2009, 131(2): 021003.
Published Online: March 27, 2009
... elastoplasticity silver alloys solders stress-strain relations tensile testing tin alloys viscoplasticity lead-free solder alloy elasto-plastic-creep constitutive model time-independent deformation time-dependent deformation One significant problem in surface mounting technology...
