... important factor for PZT-based wire clamps. Thermosonic wire bonding is the major interconnection technology used in the microelectronics package industry [ 1–3 ]. Currently, the wire bonder typically used the gold wire with the diameter of 15–25  μ m, and with the speed of 15–20 wires per second...

... and parameters were discussed. thermosonic wire bonding wire looping process material properties capillary parameters capillary trace finite element simulation Wire-bonding is a traditional interconnect method can be widely used in modern three-dimensional (3D) packages due to its existing...