... ball grid arrays ceramic packaging computational fluid dynamics deformation finite element analysis flip-chip devices integrated circuit interconnections integrated circuit packaging integrated circuit reliability light interferometry plastic packaging thermal expansion thermomechanical...

.... delamination electronics packaging fatigue testing flip-chip devices life testing nanostructured materials passivation reliability silicon compounds thermal shock thermomechanical treatment 25 07 2005 19 03 2008 17 11 2008 Underfill materials are used in flip chip...

... fatigue finite element analysis flaw detection solders thermomechanical treatment voids (solid) Pb-free solder voids thermo-mechanical durability simulation energy partitioning successive initiation damage initiation damage propagation Voids originating during the manufacturing...

... indentation hardness hardness testing viscoelasticity thermomechanical treatment 07 January 2004 18 August 2004 21 03 2005 2005 ASME ...

... micrographs of TABGA96 solder joint with voids (SAC) tin alloys silver alloys copper alloys durability thermomechanical treatment solders assembling viscoplasticity printed circuit testing surface mount technology finite element analysis Solder materials are extensively used...

...-of-the-art of thermo-mechanical thin film characterization methods, such as the substrate curvature test, nanoindentation technique, bulge test, and impulsive stimulated thermal scattering. 24 02 2004 22 12 2004 thermal management (packaging) polymer films thermomechanical treatment...

... optoelectronics electronics packaging pulsed laser deposition thermomechanical treatment Manufacturing of optoelectronic butterfly packages involves laser welding of a fiber mount followed by a realignment procedure to reverse thermally induced distortions commonly referred to as post weld shift (PWS...

... PACKAGING . Manuscript received December 2003; final revision, March 2004. Associate Editor: Guo-Quon Lu. 01 December 2003 01 March 2004 06 10 2004 solders thermomechanical treatment tin alloys silver alloys copper alloys plastic deformation viscoplasticity electronics...

... Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received July 2003; final revision, Jan. 2004. Associate Editor: W. King. 01 July 2003 01 Jan 2004 06 10 2004 flip-chip devices thermomechanical treatment bending internal stresses thermal...

... OF ELECTRONIC PACKAGING . Manuscript received July 2002. Associate Editor: Y. C. Lee. 01 July 2002 30 04 2004 ball grid arrays ceramic packaging assembling soldering thermomechanical treatment real-time systems moire fringes Design and testing of microelectronics devices...

... . Manuscript received June 2003. Associate Editor: K. Kishimoto. 01 June 2003 30 04 2004 reflow soldering surface tension wetting thermomechanical treatment reliability A review of the literature on solder joint reliability suggests that there has been significant research...

... and Photonic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received June 2003. Associate Editor: K. Kishimoto. 01 June 2003 30 04 2004 soldering lead bonding adhesion thermomechanical treatment stress analysis The reliability of solder...

...X. Q. Shi,; W. Zhou,; H. L. J. Pang, and; Z. P. Wang [S1043-7398(00)01601-7] eutectic alloys soldering thermomechanical treatment stress-strain relations mechanical properties The authors mistakenly stated that the paper “On Constitutive Response of 63/37 Pn/Sb Eutectic Solder...

... Induced Plastic Deformation in Solder Joints—Part Two: Accumulated Deformation in Through Hole Joints ,” IEEE Trans. Compon., Hybrids, Manuf. Technol. , 14 , pp. 824 – 832 . thermomechanical treatment fatigue testing thermal stresses soldering eutectic alloys tin alloys bismuth alloys...