1-7 of 7
Keywords: thermoelasticity
Close
Sort by
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2009, 131(1): 011013.
Published Online: February 18, 2009
... solder joint/bump defects, including missing, misaligned, open, and cracked solder joints/bumps in flip chips, chip scale packages, and multilayer ceramic capacitors. This system uses a pulsed Nd:YAG laser to induce ultrasound in the electronic packages in the thermoelastic regime; it then measures...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2004, 126(3): 282–287.
Published Online: October 6, 2004
... cell finite element (FE) analyses of PCB’s with both straight and wavy traces were performed to predict thermoelastic behavior. Both experimental tests and numerical analyses conclude that the PCB’s with wavy traces warped approximately 40% to 60% less than the PCB’s with straight traces...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2004, 126(3): 325–332.
Published Online: October 6, 2004
... OF ELECTRONIC PACKAGING . Manuscript received May 2003; final revision, Jan. 2004. Associate Editor: S. McKeown. 01 May 2003 01 Jan 2004 06 10 2004 thermoelasticity heat conduction thermal stress cracking integrated circuit reliability thermal stresses Fourier series integrated...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2003, 125(3): 414–419.
Published Online: September 17, 2003
... . In these investigations, the stresses at the joint interfaces are required for deriving the bending moment and the forces in each layer. Daniel et al. 14 analyzed the state of residual stresses and warpage in multilayer structures using linear thermoelastic lamination theory. Pan and Pao 15 analyzed the deformation...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2002, 124(3): 141–146.
Published Online: July 26, 2002
... thermal stresses stress analysis bending thermal management (packaging) composite material interfaces thermal expansion differential equations thermoelasticity The study of thermal mismatch induced stresses and their role in mechanical failure is one relevant topic to composite materials...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2001, 123(3): 260–267.
Published Online: January 11, 2000
... polymers moulding thermal stresses integrated circuit packaging plastic packaging integrated circuit reliability thermal expansion compressive strength elastic moduli thermoelasticity The residual thermal stresses in molding compounds affect the mechanical reliability of microelectronic...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2000, 122(4): 317–322.
Published Online: August 9, 1999
... received by the EEPD August 9, 1999; revised manuscript received April 13, 2000. Associated Technical Editor: B. Michel. 09 August 1999 integrated circuit technology thermal stress cracking crack-edge stress field analysis thermoelasticity temperature distribution stress relaxation...