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Keywords: thermal-mechanical coupling analysis
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Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Technical Briefs
J. Electron. Packag. September 2007, 129(3): 366–370.
Published Online: September 12, 2006
... implemented with an unattached drop-in heat spreader are examined through the thermal-mechanical coupling analysis. A numerical procedure is proposed to specify film coefficients as functions of gap openings on separated surfaces. Effects of mesh density and interfacial heat transfer conditions...
