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Keywords: thermal stress cracking
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Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2011, 133(2): 021007.
Published Online: June 23, 2011
... testing printed circuit manufacture solders synchrotron radiation thermal stress cracking X-ray imaging thermal fatigue life prediction crack propagation phase growth solder joints flip chip, nondestructive inspection x-ray microtomography synchrotron radiation. In electronic...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2011, 133(2): 021001.
Published Online: June 22, 2011
... relevance. These were measured as outlined below. ball grid arrays copper alloys lead alloys printed circuits reflow soldering reliability silver alloys solders thermal stress cracking tin alloys backward compatible mixed solder lead-free thermal cycling A large number of high...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2010, 132(3): 031012.
Published Online: September 30, 2010
... semiconductor device reliability temperature distribution thermal analysis thermal stress cracking Power modules are widely used in various products. For example, a converter system based on a power module is advantageous in vehicle applications, including next-generation vehicles (hybrid vehicles...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2008, 130(2): 021009.
Published Online: May 9, 2008
... integrated circuit layout integrated circuit reliability thermal stress cracking viscoelasticity In Part 1 of this paper, various failure mechanisms associated with the short-time wave propagation in the flip chip ball grid array (BGA) with an elastic underfill were investigated. As material...
Journal Articles
Article Type: Technical Briefs
J. Electron. Packag. June 2008, 130(2): 024501.
Published Online: May 8, 2008
... gas lasers laser beam cutting laser beam machining thermal stress cracking aluminum nitride cutting laser thermal stress packaging material The authors gratefully acknowledge the financial support for this research provided by the U.S. National Science Foundation under Grant...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. September 2007, 129(3): 300–306.
Published Online: November 29, 2006
... cooling finite element analysis glass seals (stoppers) thermal management (packaging) thermal stress cracking wires Airbags were responsible for saving nearly 17,000 lives between 1975 and 2004 ( 1 ). Currently about 150 million vehicles in the United States are equipped with airbags...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2005, 127(2): 96–105.
Published Online: June 3, 2005
... circuit packaging integrated circuit reliability integrated circuit interconnections printed circuits solders thermal stress cracking Weibull distribution life testing creep internal stresses The reliability of solder joints of a particular package on a printed circuit board (PCB...
Journal Articles
Article Type: Technical Briefs
J. Electron. Packag. December 2004, 126(4): 560–564.
Published Online: January 24, 2005
.... The thermomechanical properties of underfill therefore become crucial factors to the service life of FCBGA. ball grid arrays flip-chip devices failure (mechanical) integrated circuit reliability integrated circuit packaging creep testing thermal stress cracking solders Young's modulus thermal...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2004, 126(3): 325–332.
Published Online: October 6, 2004
.... McKeown. 01 May 2003 01 Jan 2004 06 10 2004 thermoelasticity heat conduction thermal stress cracking integrated circuit reliability thermal stresses Fourier series integrated circuit packaging The chip-substrate structure is an important part of IC (integrated...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2005, 127(3): 268–275.
Published Online: July 28, 2004
...) soldering thermal stress cracking fracture delamination When a plastic encapsulant absorbs moisture, it expands and causes hygrostresses to be developed in plastic-encapsulated IC packages. This is because of moisture concentration gradients in the encapsulant as well as the fact that only...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. June 2004, 126(2): 202–207.
Published Online: July 8, 2004
... devices polymers dielectric materials fracture delamination thermal stress cracking aluminium silicon Flip chip bonding technology using anisotropic conductive films (ACFs) has been used for decades in the area LCD display applications. In recent, there has been growing interest in using...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2005, 127(2): 164–171.
Published Online: June 8, 2004
... packaging encapsulation soldering delamination fracture mechanics viscoelasticity elasticity thermal analysis thermal stress cracking When a plastic IC package is in a reflow soldering process, the thermal stress in the molded package occurs due to the mismatch of thermal expansion...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. December 2003, 125(4): 531–538.
Published Online: December 15, 2003
... of the thermomechanical fatigue of solder joints in flip chip, CSP, BGA, and various surface mount device (SMD) packages suffers the uncertainties of the material database for lead-free solders. soldering flip-chip devices creep thermal stress cracking fatigue 01 November 2002 15 12 2003...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. December 2003, 125(4): 562–568.
Published Online: December 15, 2003
... 15 12 2003 soldering chip scale packaging ball grid arrays integrated circuit reliability creep flip-chip devices thermal stress cracking finite element analysis failure analysis Soft solders are used at temperatures which are above one-half of their absolute melting...
Journal Articles
Article Type: Technical Briefs
J. Electron. Packag. December 2003, 125(4): 624–629.
Published Online: December 15, 2003
... stress analysis thermal stress cracking temperature distribution plastic packaging Flip chip (FC) technology can achieve the highest ratio of active silicon surface area since it does not employ the peripheral wire bonding. In this way, it can be used to achieve a very large number of fine...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. September 2003, 125(3): 426–430.
Published Online: September 17, 2003
... . 01 Aug 2002 17 09 2003 ball grid arrays thermal stress cracking soldering reliability surface mount technology finite element analysis Thermal fatigue has been one of the most serious problems for solder joint reliability in electronic packaging. Many researchers have...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. September 2003, 125(3): 347–353.
Published Online: September 17, 2003
... Congress, New York, NY, November 11–16, 2001. Manuscript received at ASME Headquarters, Sept. 2002. Associate Editor: J. Lau. 11 November 2001 01 Sep 2002 17 09 2003 plastic packaging ball grid arrays thermal stress cracking soldering finite element analysis modelling...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. June 2003, 125(2): 261–267.
Published Online: June 10, 2003
... thermal expansion integrated circuit modelling finite element analysis plastic packaging optical fibre theory thermal stress cracking It has been shown 40 41 that thermally induced elastic stresses in sufficiently large assemblies do not increase with a further increase in the assembly size...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. March 2003, 125(1): 120–125.
Published Online: March 14, 2003
... soldering finite element analysis ball grid arrays integrated circuit packaging thermal stress cracking modelling viscoplasticity With the increasing use of surface mount bonding technology in microelectronics industry, the reliability concerns for solder joints are increasing exponentially...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. March 2003, 125(1): 31–38.
Published Online: March 14, 2003
... moulding plastic packaging integrated circuit packaging delamination thermal stress cracking bending finite element analysis reflow soldering failure analysis Plastic packaging is the most popular technique in electronic packaging because of its low costs and ease of manufacture. However...