... alternating inlet and outlet branched internal channels. It was found that using the manifold design with 3 channels reduced the thermal resistance from 0.061 to 0.054 °C/W with a pressure drop reduction of 0.77 kPa from the commercial cold plate. A geometric parametric study was performed to investigate...

... at bare and commercial thermal paste coated Cu substrates boundary conditions. The influence of interface material thickness on total thermal resistance (R th-tot ), rise in junction temperature (T J ), and optical properties of LED was analyzed. A noticeable reduction in R th-tot (5.92 K/W) as well as T...

... boundary condition was not supported to reduce the T J . The total thermal resistance (R th-tot ) was reduced for AlN-coated Cu substrate at 350 mA. The thermal resistance between metal core printed circuit board and Cu substrate (R th-b-hs ) was also observed as low for AlN-coated Cu substrates compared...

... on Thermal and Thermomechanical Phenomena in Electronic Systems ( ITHERM 2008 ), Orlando, FL, May 28–31, pp. 395 – 404 . 10.1109/ITHERM.2008.4544297 [7] Yu , H. , Li , L. , and Zhang , Y. , 2012 , “ Silver Nanoparticle-Based Thermal Interface Materials With Ultra-Low Thermal Resistance...

... Application of Magnetic Fields and Carriers (Review) ,” Pharm. Chem. , 35 ( 2 ), pp. 88 – 95 . 10.1023/A:1010425005612 Subscripts c = condenser e = evaporator h = heat Nomenclature I = amperage, A Q = power, W R = thermal resistance, °C/W T...

... of heat load, and height difference between the cooler and heater. A theoretical thermal resistance model was established and convective heat transfer coefficient was calculated to interpret the phenomenon with uncertainty analyzed. With further improvement of the present system and liquid metal coolant...

... resistance between the solid and the cavity. The optimization procedure has demonstrated that for larger solids, a cavity shaped as T led to a minimization of the global thermal resistance, while the opposite effect is observed for tall solids, where the optimal shapes are reached when the bifurcated...

... strategies in data centers. Finally, the impact of heat sink thermal resistance is considered, and the potential data center efficiency gains from improved heat sink designs are discussed. 07 04 2011 09 05 2011 21 09 2011 21 09 2011 computer centres cooling fans heat sinks...

... of simplified approaches. After a review of the available modeling strategies, steady state thermal analysis of a typical stacked ball grid array package based on a thermal resistance network is presented. The physical model is discussed in detail, together with its advantages and limitations. The results have...

.... The reduction in performance is directly related to the percentage of the included CNTs; hence, the higher the CNT fraction the greater the increase in overall thermal resistance. In the case of the lowest percentage of CNTs added, there is a small improvement at the highest pressure fraction (90 and 100 psi...

...Xiaoling Yu; Lianghua Zhang; Enming Zhou; Quanke Feng Presently, many methods are adopted to reduce the junction-to-case thermal resistance ( R jc ) of insulated-gate bipolar transistor (IGBT) modules in order to increase their power density. One of these approaches is to enhance the heat spreading...

... can be maximized by improving the thermal resistance over 40%, and the conventional TVC can be further reduced by 35%. The proposed approach is demonstrated on the multifinger InGaP/GaAs C-up HBT, which is attractive as the active component in power amplifiers. A comparison of measured, finite-element...

... number per unit volume. The channels had rectangular cross-sections with hydraulic diameters ranging from 0.762 mm to 1.389 mm. Acetone, water, diamond/acetone, gold/water, and diamond/water nanofluids were tested as working fluids. It was found that the FP-OHP’s thermal resistance depended on the power...

... fabricated to evaluate the cooling performance of this liquid metal cooling device. The compared results with typical water cooling and commercially available heat pipes show that the present device could achieve excellent cooling capability. The thermal resistance could be as low as 0.13 ° C / W , which...

... effects due to a misconception about the meaning of often-quoted flux limits and especially the physical meaning of thermal resistance. The usefulness of a number of approaches that are generally in use to analyze heat spreading effects is discussed and it is shown that the popular series-resistance...

.... 09 10 2009 26 03 2010 23 06 2010 23 06 2010 cooling electronics industry elemental semiconductors heat pipes microfabrication silicon thermal conductivity thermal resistance microheat pipes electronic cooling thermal conductivity thermal resistance performance...

...Xi Liu; Jiantao Zheng; Suresh K. Sitaraman The thermal efficacy of thermal interface material (TIM) is highly dependent on its ability to adhere to the surfaces of interest. Any delamination of the TIM from the die or the lid will increase the local thermal resistance and, thus, will reduce...

... thermal management (packaging) thermal resistance thermal resistance measurement The paper uses both the notions of the thermal resistance ( R th , in K/W units) and the thermal resistance of unit area ( θ , in K   cm 2 / W units). If the cross-sectional area...

... vapor cell. Each of these must be maintained at 70 + / − 0.1 ° C even over large ambient temperature variations of 0 – 50 ° C . Thus the physics package of a CSAC device, which contains the vapor cell, VCSEL, and optical components, must have a very high thermal resistance, greater than 5.83 ° C / m W...

... by itself was found to contribute more than half of the overall thermal resistance of the cooling device. The thermal spreading resistance of the block can be reduced by about 70% if a piece of high-conductivity material, such as a diamond-copper composite, is inserted into its base. The thermal spreading...