... no interfacial thermal convection, the temperature distribution is discontinuous across the interface. Temperature contours (°C) 04 07 2006 12 09 2006 cooling thermal management (packaging) thermal-mechanical coupling analysis thermal contact quad flat package (QFP) drop...

...Zongrong Liu; D. D. L. Chung Wax (predominantly tricosane paraffin wax, with a melting temperature of 48 ° C ) filled with hexagonal boron nitride (BN) particles ( 5 - 11 μ m ) was found to be an effective phase-change thermal interface material. The thermal contact conductance, as measured...

... of the salt to release Li + ions, gives thermal contact conductance that is almost as high as that given by Sn-Pb solder, similar to that given by boron nitride particle filled sodium silicate, and much higher than that given by boron nitride particle filled silicone. Contributed by the Electronic...

...Xiangcheng Luo,; Yunsheng Xu, and; D. D. L. Chung Thermal interface pastes based on silicone, lithium doped polyethylene glycol (PEG), and sodium silicate were evaluated in their performance before and after heating up to 120°C. The thermal contact conductance of any of the pastes between copper...