...Ken-ichi Ohguchi; Katsuhiko Sasaki; Setsuo Aso This paper proposes a method to estimate basic material constants in an elasto-plastic-creep constitutive model for lead-free solders by conducting only a tensile test. The test employs a stepped ramp wave loading, which repeats instantaneous strain...

.... C. Chan. 06 January 2004 08 June 2004 21 03 2005 chip scale packaging adhesive bonding wafer bonding adhesives organic compounds fracture toughness tensile strength tensile testing Wafer bonding may be considered as one of the enabling techniques, extending...

... , “ Reliability of Soldered Joints: a Description of the State of the Art, Part 1 ,” Surf. Mount. Technol. 0893-3588 , 4 , pp. 27 – 38 . ball grid arrays integrated circuit packaging printed circuit manufacture solders tensile testing printed circuit testing finite element analysis tin alloys...

..., the rate of aging of Kapton-E polyimide is quantified as a function of temperature and humidity exposure using peel and tensile tests. An accelerated test methodology that accounts for both aging and fatigue and that can be used to evaluate the resistance of electronic products to polyimide deadhesion...

... microstructure softening dispersion hardening tensile testing quench hardening solders Anderson , I. E. , Foley , J. C. , Cook , B. A. , Harringa , J. , Terpstra , R. L. , and Unal , D. , 2001 , “ Alloying Effects in Near-Eutectic Sn-Ag-Cu Solder Alloys for Improved...