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Keywords: tensile testing
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Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2009, 131(2): 021003.
Published Online: March 27, 2009
...Ken-ichi Ohguchi; Katsuhiko Sasaki; Setsuo Aso This paper proposes a method to estimate basic material constants in an elasto-plastic-creep constitutive model for lead-free solders by conducting only a tensile test. The test employs a stepped ramp wave loading, which repeats instantaneous strain...
Journal Articles
Article Type: Article
J. Electron. Packag. March 2005, 127(1): 7–11.
Published Online: March 21, 2005
.... C. Chan. 06 January 2004 08 June 2004 21 03 2005 chip scale packaging adhesive bonding wafer bonding adhesives organic compounds fracture toughness tensile strength tensile testing Wafer bonding may be considered as one of the enabling techniques, extending...
Journal Articles
Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2004, 126(3): 390–397.
Published Online: October 6, 2004
..., the rate of aging of Kapton-E polyimide is quantified as a function of temperature and humidity exposure using peel and tensile tests. An accelerated test methodology that accounts for both aging and fatigue and that can be used to evaluate the resistance of electronic products to polyimide deadhesion...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. June 2004, 126(2): 208–212.
Published Online: July 8, 2004
... microstructure softening dispersion hardening tensile testing quench hardening solders Anderson , I. E. , Foley , J. C. , Cook , B. A. , Harringa , J. , Terpstra , R. L. , and Unal , D. , 2001 , “ Alloying Effects in Near-Eutectic Sn-Ag-Cu Solder Alloys for Improved...