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Keywords: swelling
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2005, 127(2): 113–119.
Published Online: June 3, 2005
... properties, including modulus reduction, Tg depression, polymer hydrolysis, and surface swelling after exposing to humidity aging. The deterioration in reliability of aged ACF joint during reflow process was mainly caused by hydroscopic swelling-induced stress of ACF. 8 Surface morphology of cured ACF...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2002, 124(3): 184–187.
Published Online: July 26, 2002
... of the interconnects, are found to create new failure modes due to hygromechanical swelling. Based on experimental observations, the failure mechanism is hypothesized to be cracking of intermetallics, which have weakened due to thermal aging. Pseudo 3-D finite element analyses are conducted to quantify the moisture...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2002, 124(2): 122–126.
Published Online: May 2, 2002
...E. H. Wong; R. Rajoo; S. W. Koh; T. B. Lim A reliable technique for characterizing the hygroscopic swelling of materials has been developed and used to characterize a number of packaging materials. Using these data, hygroscopic stress modeling were performed. The hygroscopic stress induced through...