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Keywords: spectral analysis
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2003, 125(1): 39–43.
Published Online: March 14, 2003
.... 03 December 2001 14 03 2003 flip-chip devices reflow soldering inspection quality control light interferometry ultrasonic applications spectral analysis data acquisition time-domain analysis signal processing Consumer demands are driving the current trend...
