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Keywords: solderless technology
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Journal Articles
Hironori Tohmyoh, Kiichiro Yamanobe, Masumi Saka, Jiro Utsunomiya, Takeshi Nakamura, Yoshikatsu Nakano
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2008, 130(3): 031007.
Published Online: July 30, 2008
... 01 02 2008 30 07 2008 assembling elasticity finite element analysis plasticity press fitting printed circuit manufacture press-fit assembly solderless technology finite element analysis elastic-plastic properties friction coefficient Due to concerns about...
