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Keywords: solder joint
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Journal Articles
Article Type: Research-Article
J. Electron. Packag. June 2023, 145(2): 021007.
Paper No: EP-22-1044
Published Online: September 28, 2022
... (LTS) alloys have recently received considerable attention because of their low cost and reduced defects in complex assemblies. The shear and fatigue properties of individual solder joints were tested using an Instron micromechanical testing system in this research. Two novel solder alloys (Sn-58Bi...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. March 2023, 145(1): 011102.
Paper No: EP-22-1016
Published Online: September 27, 2022
...Mitsuaki Kato; Takahiro Omori; Akihiro Goryu; Tomoya Fumikura; Kenji Hirohata The larger current densities accompanying increased output of power modules are expected to degrade solder joints by electromigration. Although previous research has experimentally studied electromigration in solder, die...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. June 2022, 144(2): 021102.
Paper No: EP-21-1053
Published Online: September 13, 2021
...Mitsuaki Kato; Takahiro Omori; Akihiro Goryu; Tomoya Fumikura; Kenji Hirohata Power modules are being developed to increase power output. The larger current densities accompanying increased power output are expected to degrade solder joints in power modules by electromigration. In previous research...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. March 2022, 144(1): 011006.
Paper No: EP-20-1108
Published Online: August 6, 2021
...Tae-Yong Park; Hyun-Ung Oh To overcome the limitations of Steinberg's theory for evaluating the mechanical safety of the solder joints of spaceborne electronics in a launch random vibration environment, a critical strain-based methodology was proposed and validated in a previous study. However...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. March 2021, 143(1): 011008.
Paper No: EP-19-1117
Published Online: June 23, 2020
...Minghong Jian; Sinan Su; Sa'd Hamasha; Mohammad M. Hamasha; Atif Alkhazali The reliability of solder joints plays a critical role in electronic assemblies. SnAgCu solder alloys with doped elements such as Bi and Sb is one of the candidates for high reliability applications. However, the mechanical...
Journal Articles
Article Type: Review Articles
J. Electron. Packag. December 2019, 141(4): 040802.
Paper No: EP-18-1117
Published Online: May 17, 2019
...Sinan Su; Francy John Akkara; Ravinder Thaper; Atif Alkhazali; Mohammad Hamasha; Sa'd Hamasha Fatigue failure of solder joints is one of the major causes of failure in electronic devices. Fatigue life prediction models of solder joints were first put forward in the early 1960s, and since...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. March 2014, 136(1): 011001.
Paper No: EP-13-1028
Published Online: November 22, 2013
... , “ Influence of Intermetallic Compounds on the Adhesive Strength of Solder Joints ,” Mater. Sci. Eng., A , 333 , pp. 24 – 34 . 10.1016/S0921-5093(01)01820-2 [2] Lee , T. Y. , Choi , W. J. , Tu , K. N. , Jang , J. W. , Kuo , S. M. , Lin , J. K. , Frear , D. R. , Zeng , K...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2011, 133(3): 031004.
Published Online: September 14, 2011
...Tong An; Fei Qin The significant difference between failure modes of lead-containing and lead-free solder joints under drop impact loading remains to be not well understood. In this paper, we propose a feasible finite element approach to model the cracking behavior of solder joints under drop...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2010, 132(2): 021006.
Published Online: June 23, 2010
... requirements. Land grid array (LGA) package has been becoming popular in portable electronics in terms of low profile on the printed wiring boards and direct Pb-free assembly process compatibility. With the package profile shrinking and operating power increasing, solder joint quality and reliability has...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2009, 131(2): 021002.
Published Online: March 27, 2009
...Yi-Shao Lai; Ying-Ta Chiu; Chiu-Wen Lee Designed experiments were conducted in this paper to study the effect of Au/Ni/Cu or Cu substrate pad metallization on the electromigration reliability of 96.5Sn–3Ag–0.5Cu flip-chip solder joints with Ti/Ni(V)/Cu under bump metallurgy (UBM) under a current...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2008, 130(4): 041001.
Published Online: November 13, 2008
...Yi-Shao Lai; Ying-Ta Chiu This work presents electromigration reliability and patterns of Sn–3Ag–0.5Cu and Sn – 3 Ag – 1.5 Cu ∕ Sn – 3 Ag – 0.5 Cu composite flip-chip solder joints with Ti ∕ Ni ( V ) ∕ Cu under bump metallurgy (UBM), bonded on Au ∕ Ni ∕ Cu substrate pads. The solder joints were...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. March 2007, 129(1): 98–104.
Published Online: April 18, 2006
...Chang-Lin Yeh; Yi-Shao Lai The ball impact test is developed as a package-level measure of the board-level reliability of solder joints in the sense that it leads to brittle intermetallic fracturing, similar to that from a board-level drop test. Following classical structural dynamics principles...
Journal Articles
Article Type: Technical Briefs
J. Electron. Packag. March 2003, 125(1): 153–156.
Published Online: March 14, 2003
...Y. C. Chan; S. H. Fan; J. K. L. Lai In this study, the diffusion behavior and microstructural evolution of Cu-Sn intermetallics at eutectic Sn-Pb solder/copper substrate interface of PBGA solder joints was studied. The PBGA solder joints were formed by different profiles, which was devised to have...
Journal Articles
Article Type: Papers On Reliability
J. Electron. Packag. September 2001, 123(3): 290–294.
Published Online: July 14, 1999
...S. H. Fan; Y. C. Chan; J. K. L. Lai The shear cycle fatigue lifetimes of plastic ball grid array (PBGA) solder joints formed using different reflow profiles are studied in this paper. The profiles were devised to have the same “heating factor” but to have different conveyor speeds. The test results...