...Xiaoqin Lin; Le Luo Lead-free solder bumping and its related interconnection and reliability are becoming one of the important issues in today’s electronic packaging industry. In this paper, alloy electroplating was used as SnAg solder bumping process. Multiple reflow was preformed on as-plated...

...Jin Yang; I. Charles Ume Microelectronics packaging technology has evolved from through-hole and bulk configurations to surface-mount and small-profile configurations. Surface mount devices, such as flip chip packages, chip scale packages, and ball grid arrays, use solder bump interconnections...

... solder joints ( 19 ), were segregated and distributed inside the solder bump. Sn - 3.5 Ag - 1 Cu V 3 − bump under 5 kA ∕ cm 2 at 150 ° C at 774 h 01 11 2005 19 05 2006 flip-chip devices electromigration solders...