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Keywords: simulation of temperature filed
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. December 2013, 135(4): 044501.
Paper No: EP-13-1024
Published Online: September 6, 2013
... with actual measured highest temperature in this circumstance. It demonstrates the established model is satisfied, and the simulation result is reliable, which is significant to guide practical application. laser welding QFP devices without solder tensile strength simulation of temperature filed...
