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Keywords: semiconductor technology
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Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. December 2010, 132(4): 041005.
Published Online: November 24, 2010
... a pressure sensitive adhesive requires pressure. Taguchi warpage bonding sheet flexible copper-clad laminate laminations semiconductor technology sheet materials Taguchi methods 18 03 2010 02 08 2010 24 11 2010 24 11 2010 2010 American Society of Mechanical...
