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Keywords: response surface methodology
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Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2009, 131(2): 021005.
Published Online: April 1, 2009
... 07 01 2009 01 04 2009 finite volume methods heat sinks heat transfer laminar flow microchannel flow Navier-Stokes equations polynomial approximation quadratic programming response surface methodology thermal resistance trapezoidal microchannel electronic cooling...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2007, 129(4): 411–420.
Published Online: January 25, 2007
... the least effect on heat-transfer performance for both stationary and rotating cases. Furthermore, the comparisons between the predictions by using the quadratic response surface methodology and the experimental data for both stationary and rotating cases are made with a satisfactory agreement. Finally...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. March 2007, 129(1): 9–18.
Published Online: September 21, 2006
... reliability finite element analysis circuit optimisation response surface methodology Solder joint modeling efforts have been undertaken more and more as they are deemed critical in the reliability of electronic packaging. Finite element analysis tools are widely...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 410–422.
Published Online: January 24, 2005
... performance analyzers for PPF heat sinks have been developed. A screening experimental design using the Taguchi method is performed to determine key factors that are critical to the design and screen out unimportant design factors; and a Response Surface Methodology is then applied to establish analytical...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. June 2004, 126(2): 237–246.
Published Online: July 8, 2004
... mechanical compliance may not have good electrical performance. Therefore, a trade off is needed. Using response surface methodology (RSM), an optimization has been done. Furthermore, reliability of the optimized G-helix interconnects in a silicon-on-organic substrate assembly has been assessed, which...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. December 2003, 125(4): 490–497.
Published Online: December 15, 2003
... of Microelectronics , 28 ( 1 ), pp. 3 – 5 . Contributed by the Electronic and Photonic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received Nov. 2002. Associate Editor: L. Ernst. 01 Nov 2002 15 12 2003 response surface methodology integrated...