... integrated circuit testing life testing printed circuit design printed circuit testing semiconductor device packaging semiconductor device reliability 19 03 2010 19 03 2010 Mechanical Design of Electronic Systems ,by Dally James W. Lall Pradeep Suhling Jeffrey C...

... of using the full-field measurement technique used in this study. 06 02 2007 11 01 2008 17 11 2008 accelerometers electronic engineering computing impact (mechanical) printed circuit testing printed circuits strain gauges transient response With the ever-growing market...

.... 30 03 2007 10 09 2007 08 05 2008 circuit reliability circuit simulation elastic moduli printed circuit design printed circuit testing solders PCB FE simulation modal test drop test Handheld electronic products such as personal digital assistant and mobile...

..., but Wong ignored the effect of viscoelastic material. PCB drop impact dynamic analysis viscoelasticity materials testing printed circuit testing printed circuits substrates viscoelasticity 21 01 2006 15 03 2007 2007 American Society of Mechanical Engineers ...

..., the package with smaller solder joints and a smaller joint pitch suffers a greater drop reliability concern. 22 01 2006 06 06 2006 chip scale packaging circuit reliability solders mechanical testing transient analysis printed circuit testing board-level drop test WLCSP...

... 2006 printed circuit design printed circuit testing electronics packaging failure analysis life testing dynamic testing heat transfer Over the years NASA has observed some component failures in the space shuttle’s solid rocket booster’s (SRB) integrated electronic assembly circuit...

... the modulus of the interconnection materials, reducing the span of the PCB, or using either a very thin or a very thick PCB. 05 11 2004 30 03 2005 impact testing printed circuit testing stress-strain relations reliability electronic packaging drop impact finite element parametric...

... circuit manufacture solders tensile testing printed circuit testing finite element analysis tin alloys silver alloys lead alloys failure analysis testing 62/63/2 solder in situ solder characterization area array package chips BGA printed wiring boards test methods failure modes...

... viscoplasticity printed circuit testing surface mount technology finite element analysis Solder materials are extensively used as interconnects in packaging technologies. In surface mount technologies the solder interconnect is required to act as not only an electronic and logical path but also...

... February 2003 01 February 2004 06 10 2004 thermal expansion printed circuit testing printed circuit manufacture finite element analysis thermoelasticity printed circuit design Printed circuit boards (PCB’s) are generally constructed using two types of routing strategies...

... circuit testing polymers High pin count and high-density electronics continue to push electronic packaging materials to their limits. The next generation of high performance packages such as multichip modules, flip-chip, chip scale ball grid array, etc., requires low cost, high density, and high...

... captured. 21 01 2003 26 06 2004 printed circuits printed circuit manufacture thermal management (packaging) natural convection ball grid arrays printed circuit testing surface mount technology With ever-reducing product development cycle times preventing extensive...

.... A morrow energy model was examined and found to be a proper low cycle fatigue model for solder joints under mixed mode loading condition. 01 10 2003 26 05 2004 tin alloys lead alloys silver alloys copper alloys solders ball grid arrays printed circuit testing fatigue testing...

... analysis thermal variables measurement flow measurement printed circuit testing thermal resistance heat transfer thermal conductivity Electronic system designers are still unable to make accurate predictions of the operational temperatures of critical components and therefore the reliability...

... received at ASME Headquarters, May 2002. Guest Editor: Bernd Michel. 04 December 2000 01 May 2002 14 03 2003 surface mount technology printed circuit accessories printed circuit testing adhesives impact testing impact strength filled polymers conducting polymers shear...

... printed circuit testing bending impact testing impact strength adhesives shear strength interconnections circuit reliability scanning electron microscopy failure (mechanical) Surface mount technology (SMT) continues to be significantly important to the electronics manufacturing industry...

... in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received by the EPPD December 20, 1999. Associate Editor: Y. Joshi. 20 December 1999 printed circuit testing heat transfer forced convection cooling printed circuit design As electronics become more prevalent and ubiquitous...

... November 1999 flip-chip devices integrated circuit packaging soldering tin alloys lead alloys thermal stress cracking encapsulation life testing printed circuit testing finite element analysis integrated circuit bonding failure analysis One of the key technologies of dense LSI...

... electron microscopy cooling solidification sliding friction printed circuit testing 14 July 1999 Contributed by the Electrical and Electronic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received by the EEPD July 14, 1999. Associate Editor. S...