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Keywords: printed circuit design
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Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2011, 133(4): 041010.
Published Online: December 9, 2011
... shape and duration. Typical drop tower 12 03 2010 13 04 2011 09 12 2011 09 12 2011 assembling failure analysis finite element analysis printed circuit design transient response vibrations Portable electronic devices are frequently subjected...
Journal Articles
Publisher: ASME
Article Type: Book Reviews
J. Electron. Packag. March 2010, 132(1): 016501.
Published Online: March 19, 2010
... integrated circuit testing life testing printed circuit design printed circuit testing semiconductor device packaging semiconductor device reliability 19 03 2010 19 03 2010 Mechanical Design of Electronic Systems ,by Dally James W. Lall Pradeep Suhling Jeffrey C...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2008, 130(2): 021007.
Published Online: May 8, 2008
.... 30 03 2007 10 09 2007 08 05 2008 circuit reliability circuit simulation elastic moduli printed circuit design printed circuit testing solders PCB FE simulation modal test drop test Handheld electronic products such as personal digital assistant and mobile...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2007, 129(1): 90–97.
Published Online: April 19, 2006
... thermal and wiring density, have to be optimized simultaneously, it is difficult for the designer to optimize component locations without using a systematic optimization method. 12 12 2005 19 04 2006 printed circuit design thermal management (packaging) genetic algorithms neural...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2006, 128(4): 449–455.
Published Online: February 15, 2006
... positions. Although relatively large differences between the calculated, optimized fundamental frequencies and the experimental values are observed, the experiments confirm a very significant improvement in frequency for both cases. 09 10 2005 15 02 2006 printed circuit design cooling...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2006, 128(4): 339–345.
Published Online: January 8, 2006
... 2006 printed circuit design printed circuit testing electronics packaging failure analysis life testing dynamic testing heat transfer Over the years NASA has observed some component failures in the space shuttle’s solid rocket booster’s (SRB) integrated electronic assembly circuit...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 524–527.
Published Online: January 24, 2005
... September 2004 24 01 2005 printed circuits printed circuit design product development circuit analysis computing thermal analysis electrical engineering computing During the electrical computer-aided development of a product, the primary task of design engineers is to create...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2004, 126(3): 282–287.
Published Online: October 6, 2004
... February 2003 01 February 2004 06 10 2004 thermal expansion printed circuit testing printed circuit manufacture finite element analysis thermoelasticity printed circuit design Printed circuit boards (PCB’s) are generally constructed using two types of routing strategies...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2003, 125(3): 362–368.
Published Online: September 17, 2003
... Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received June 2001; final revision, December 2001. Associate Editor: A. Y.-H. Hung. 01 June 2001 01 December 2001 17 09 2003 modules forced convection printed circuit design wakes...
Journal Articles
Publisher: ASME
Article Type: Additional Technical Papers
J. Electron. Packag. December 2001, 123(4): 388–393.
Published Online: November 1, 2000
... OF ELECTRONIC PACKAGING . Manuscript received by the EPPD July 6, 2000; revised manuscript received November 2000. Associate Editor: B. Courtois. 06 July 2000 01 November 2000 printed circuit manufacture printed circuit design surface mount technology Substrate fixture tooling...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2001, 123(2): 132–140.
Published Online: September 14, 2000
...; revised manuscript received September 14, 2000. Associate Editor: J. Lau. 30 August 1999 14 September 2000 ball grid arrays plastic packaging optimisation finite element analysis matrix decomposition circuit analysis computing printed circuit design New products...
Journal Articles
Publisher: ASME
Article Type: Book Reviews
J. Electron. Packag. June 2000, 122(2): 178–179.
Published Online: June 1, 2000
... BY: ANTHONY J. RAFANELLI packaging reviews printed circuit design thermal management (packaging) interconnections electric connectors 2000 ASME ...
Journal Articles
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. June 2001, 123(2): 156–158.
Published Online: March 31, 2000
... electronic device mounted on a circuit board. The model includes a flush-mounted heater to represent the electronic device, a two-layer substrate to represent the circuit board, and a steady shear flow to represent the cooling fluid. printed circuit design forced convection cooling temperature...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2000, 122(4): 341–349.
Published Online: February 25, 2000
... by the EEPD July 13, 1999; revised manuscript received February 25, 2000. Associate Technical Editor: B. Michel. 13 July 1999 25 February 2000 vibrations modal analysis supports optimisation printed circuit design In many engineering structures, one is normally interested...
Journal Articles
Publisher: ASME
Article Type: Additional Technical Papers
J. Electron. Packag. December 2001, 123(4): 356–365.
Published Online: December 20, 1999
... in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received by the EPPD December 20, 1999. Associate Editor: Y. Joshi. 20 December 1999 printed circuit testing heat transfer forced convection cooling printed circuit design As electronics become more prevalent and ubiquitous...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2000, 122(2): 152–159.
Published Online: October 20, 1999
... printed circuits heat transfer cooling convection optimisation printed circuit design The optimal placement of components on printed wiring boards requires satisfying multiple, possibly conflicting, design objectives. As pointed out by Moresco 1 , these design objectives may be very...