.... diamond fluid oscillations gold heat pipes microfluidics pipe flow thermal management (packaging) thermal resistance 06 04 2010 31 07 2010 24 11 2010 24 11 2010 2010 American Society of Mechanical Engineers ...

... 06 10 2004 cooling pipe flow condensation silicon boiling two-phase flow integrated circuit packaging Direct and indirect liquid cooling with phase-change by use of dielectric liquids have been considered as promising cooling schemes for high-powered electronic devices 1 2...

... sinks computational fluid dynamics thermal management (packaging) pressure flow simulation pipe flow The trend in modern electronic systems design is to increase the speed and power of processing while at the same time reducing the size and weight of the electronic device 1...

... conductivity pipe flow forced convection Heatsinks for processors have evolved in recent years as power has increased. The first personal computers required large enclosures for the low density packaging of the early 1980s. Cooling of the processor was achieved by the airflow induced by the cooling...

.... Culham. 12 October 2001 10 06 2003 heat pipes capillarity two-phase flow evaporation undercooling flow separation flow through porous media thermal conductivity pipe flow The control of operating temperature, regardless of power input, makes future use of CPL systems...

.... integrated circuit packaging natural convection forced convection cooling external flows pulsatile flow pipe flow channel flow boundary layers laminar flow When D becomes sufficiently small, the channel formed between two boards becomes narrow enough for the flow and heat transfer...

... Editor: R. Wirtz. 11 October 2000 microcomputers cooling computational fluid dynamics pipe flow heat sinks The central processor unit (CPU) in a desktop computer must be cooled to limit its temperature to the manufacturer’s maximum allowed value. Typical limiting CPU die...