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Keywords: piezoresistive devices
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Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2009, 131(3): 031013.
Published Online: July 31, 2009
.... Microeng. 0960-1317 , 8 , pp. 168 – 171 . 10.1088/0960-1317/8/2/032 22 09 2008 27 03 2009 31 07 2009 electronics packaging elemental semiconductors finite element analysis membranes moulding photoresists piezoresistive devices pressure sensors silicon...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. December 2003, 125(4): 466–469.
Published Online: December 15, 2003
... June 2003. Associate Editor: Y. C. Lee. 01 May 2001 01 June 2003 15 12 2003 pressure sensors piezoresistive devices finite element analysis Various kinds of pressure sensors have been produced 1 . One of them is the Differential Pressure Feedback (DPFE) Sensor...
Journal Articles
Article Type: Additional Technical Papers
J. Electron. Packag. June 2003, 125(2): 289–293.
Published Online: June 10, 2003
... by the EPPD Division April 30, 2002. Associate Editor: K. Kishimoto. 30 April 2002 10 06 2003 piezoresistive devices stress measurement electric sensing devices calibration integrated circuit packaging integrated circuit measurement Piezoresistive stress sensors have been...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. June 2002, 124(2): 115–121.
Published Online: May 2, 2002
... ,” J. of Chung-Cheng Institute of Technology , 29 , No. 1 , pp. 15 – 22 . (In Chinese) internal stresses integrated circuit packaging piezoresistive devices electric sensing devices calibration plastic packaging thermal stresses As chip area expands in order to accommodate more...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. March 2002, 124(1): 22–26.
Published Online: February 21, 2000
... February 2000 stress measurement piezoresistive devices electric sensing devices integrated circuit packaging calibration As die size and power density of an microelectronic circuit increased continuously in modern IC technology, stresses induced in a die from packaging becomes serious...