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Keywords: physics of failure
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Journal Articles
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. June 2023, 145(2): 020801.
Paper No: EP-22-1045
Published Online: October 22, 2022
... with Standards such as Joint Electron Device Engineering Council (JEDEC) and Institute for Printed Circuits (IPC) is to the best of our knowledge lacking. To fill this gap, a detailed review of failure mechanism driven reliability models, with emphasis on physics of failure (PoF) for power electronics...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2018, 140(4): 041003.
Paper No: EP-17-1047
Published Online: August 20, 2018
.... Physics of failure Reliability Solder Thermal analysis 03 05 2017 16 07 2018 Contributed by the Electronic and Photonic Packaging Division of ASME for publication in the J OURNAL OF E LECTRONIC P ACKAGING . Manuscript received May 3, 2017; final manuscript received July 16, 2018...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2018, 140(3): 031008.
Paper No: EP-18-1004
Published Online: June 26, 2018
... MEMS Microsystems Physics of failure Reliability Sensors Microelectromechanical systems (MEMS) have been widely used in many sensor applications. They can be miniaturized and integrated into the standard CMOS process. Most MEMS structures are moveable and easily generate cyclic deflection...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2018, 140(2): 020901.
Paper No: EP-17-1092
Published Online: May 9, 2018
... received September 20, 2017; final manuscript received January 12, 2018; published online May 9, 2018. Assoc. Editor: Reza Khiabani. 20 09 2017 12 01 2018 Composite materials Physics of failure Thermal analysis Thermal interface materials (TIMs) play a crucial role...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2018, 140(2): 020905.
Paper No: EP-17-1083
Published Online: May 9, 2018
... temperatures and harsh road conditions. Managing and optimizing against these goals can be very challenging. BGA Connectors Harsh environment Physics of failure Reliability 16 09 2017 13 01 2018 Contributed by the Electronic and Photonic Packaging Division of ASME...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2018, 140(1): 010906.
Paper No: EP-17-1101
Published Online: March 2, 2018
... LECTRONIC P ACKAGING . Manuscript received September 28, 2017; final manuscript received January 4, 2018; published online March 2, 2018. Assoc. Editor: Sreekant Narumanchi. 28 09 2017 04 01 2018 Composite materials DCA Electronic Failure analysis Harsh environment Physics...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2018, 140(1): 010903.
Paper No: EP-17-1090
Published Online: March 2, 2018
...) Virtual techniques: Schemes of validated simulations allow capturing the physics of failure (PoF) proactively in the design for reliability (DfR) process; and (iii) Prognostics health management (PHM). A new concept is introduced for adding a minimum of PHM features at various levels of automotive...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2017, 139(4): 041006.
Paper No: EP-17-1070
Published Online: October 5, 2017
...-Shao Lai. 25 07 2017 19 09 2017 Displays Physics of failure Reliability Edge-lit light guides are a common source of illumination for LCD displays in televisions, monitors, and laptop or tablet computers. A polymeric light diffusing plate is illuminated at its edges...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2017, 139(4): 041003.
Paper No: EP-17-1033
Published Online: August 25, 2017
.... 22 03 2017 04 06 2017 Physics of failure Reliability Thin films deposited on substrates are used in a wide range of applications, including microelectronics, in which they are commonly stacked and patterned. For microelectronic packaging applications, copper thin films...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2017, 139(3): 031002.
Paper No: EP-16-1064
Published Online: June 14, 2017
... OURNAL OF E LECTRONIC P ACKAGING . Manuscript received May 18, 2016; final manuscript received January 3, 2017; published online June 14, 2017. Assoc. Editor: Toru Ikeda. 18 05 2016 03 01 2017 Failure analysis Harsh environment Microsystems Physics of failure Reliability SMT...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2017, 139(2): 020906.
Paper No: EP-16-1138
Published Online: June 12, 2017
... online June 12, 2017. Assoc. Editor: S. Ravi Annapragada. 14 12 2016 30 03 2017 3D packaging Electrical design Physics of failure Reliability Once a chip is architected and the major IP blocks have been selected, the next phase is typically the creation of the preliminary...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. March 2017, 139(1): 010802.
Paper No: EP-16-1107
Published Online: January 16, 2017
... September 17, 2016; final manuscript received December 19, 2016; published online January 16, 2017. Assoc. Editor: Eric Wong. 17 09 2016 19 12 2016 Physics of failure Plastic Electronics Reliability Due to its amorphous nature and topographical imperfection, polymeric...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. December 2015, 137(4): 040802.
Paper No: EP-15-1068
Published Online: September 25, 2015
... ACKAGING . Manuscript received July 22, 2015; final manuscript received August 30, 2015; published online September 25, 2015. Assoc. Editor: Mehdi Asheghi. 22 07 2015 30 08 2015 3D packaging Chip stacking Failure analysis Physics of failure Thermal analysis Three...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2015, 137(1): 011009.
Paper No: EP-14-1062
Published Online: October 15, 2014
... utilizing uniaxial vibration along a direction other than the principal directions of the structure was examined. This method was found to have significant limitations, but showed better agreement with simultaneous multiaxial vibration experiments. Failure analysis Harsh environment Physics...
Journal Articles