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Keywords: photoresists
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Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2009, 131(3): 031013.
Published Online: July 31, 2009
...Lung-Tai Chen; Wood-Hi Cheng This study presents a novel technique for an overmolded package of piezoresistive pressure sensors using an ultrathick photoresist sacrificial layer. A 150 μ m photoresist block is placed just on the silicon membrane of the pressure sensor and removed after the molding...
Journal Articles
Article Type: Article
J. Electron. Packag. March 2005, 127(1): 38–42.
Published Online: March 21, 2005
... the silicon-based PCR chip, a low-temperature bonding technique using polymers as the intermediate layers has been developed. The tested polymers include positive photoresist, polyimide, and epoxy. Using stamping and sandwich techniques, void-free and liquid-proof bondings of silicon to a glass cover were...