...Lung-Tai Chen; Wood-Hi Cheng This study presents a novel technique for an overmolded package of piezoresistive pressure sensors using an ultrathick photoresist sacrificial layer. A 150 μ m photoresist block is placed just on the silicon membrane of the pressure sensor and removed after the molding...

... the silicon-based PCR chip, a low-temperature bonding technique using polymers as the intermediate layers has been developed. The tested polymers include positive photoresist, polyimide, and epoxy. Using stamping and sandwich techniques, void-free and liquid-proof bondings of silicon to a glass cover were...