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Journal: Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. September 2009, 131(3): 031013.
Published Online: July 31, 2009
...Lung-Tai Chen; Wood-Hi Cheng This study presents a novel technique for an overmolded package of piezoresistive pressure sensors using an ultrathick photoresist sacrificial layer. A 150 μ m photoresist block is placed just on the silicon membrane of the pressure sensor and removed after the molding...