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Keywords: peeling stress
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2011, 133(4): 041014.
Published Online: December 21, 2011
...D. Sujan; Dereje E. Woldemichael; M. V. V. Murthy; K. N. Seetharamu When two thin plates or layers are bonded together, an extremely thin bond layer of third material exists between the two layers. This research work examines the effect of bond layer on the interfacial shearing and peeling stresses...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2008, 130(3): 031005.
Published Online: July 30, 2008
... by finite element simulation. The filler settling has a localized but strong influence on the interfacial peeling stress near the edge of the die. The extent of this influence is determined by the profile of filler settling: (1) if the filler is assumed to settle in the form of a bilayer, then the peeling...