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Keywords: microsensors
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Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2009, 131(4): 041009.
Published Online: November 12, 2009
... circuit packaging microfabrication microsensors Taguchi methods glass cover chip CMOS image sensor Taguchi method packaging process Rapid technological advancements in the semiconductor field, combined with growing consumer demand for products with increasing levels of functionality...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2005, 127(3): 286–289.
Published Online: August 4, 2004
... measurement microsensors thermocouples heat conduction Seebeck effect Seebeck Coefficient Temperature Sensors Thermocouple Arrays Thin Film There are a number of ways to measure temperatures microscopically, including infrared thermography, liquid crystal thermography, thermistors...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. December 2003, 125(4): 470–474.
Published Online: December 15, 2003
.... A silicon oxide layer is formed between the silicon substrate and glass to provide a hermetic sealing. The transducer on the top of the silicon diaphragm senses the pressure from the top of the sensing element. Sensors of this kind are called absolute pressure sensors. microsensors pressure...
Journal Articles
Article Type: Papers On Reliability
J. Electron. Packag. March 2001, 123(1): 79–82.
Published Online: May 26, 2000
.... Contributed by the Electrical and Electronic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received by the EEPD September 9, 1999; revised manuscript received May 26, 2000. Associate Editor: M. Shiratori. 09 September 1999 26 May 2000 microsensors...