... for full chip Joule heating simulations and for clock signal propagation simulations, which are performed as part of designing next generation chip architectures. 13 03 2006 23 10 2007 29 07 2008 heat conduction integrated circuit interconnections mesh generation...

... packaging mesh generation finite element analysis stress analysis multilayers A number of researchers proposed closed-form solutions for stresses in laminated stacks subjected to temperature gradient. These closed-form equations offer a rapid method to obtain stresses in the materials...