... laminates mechanical testing shear strength solders The transition of most microelectronics products to lead free assembly has led to new challenges even for those industry sectors still exempt from the requirement to change solder alloys. The overall volume of products manufactured by the latter...

... strength copper alloys creep elastoplasticity electronics packaging fatigue mechanical testing silver alloys solders tensile strength tin alloys 09 12 2009 14 09 2010 23 11 2010 23 11 2010 The method described in Sec. 4 was applied to all the cyclic loadings...

... as the elastic mismatch. 22 02 2009 18 09 2009 25 02 2010 25 02 2010 delamination mechanical testing shear strength thin films delamination blister test energy release rate phase angle shear effect Thin films have been finding more and more applications in diverse...

... devices nanoparticles soldering assembling fine-pitch technology fatigue testing mechanical testing delamination fatigue cracks fracture passivation silicon compounds To enhance solder bump reliability in flip chips on organic substrates, an epoxy-based underfill is often dispensed...

... 63Sn–37Pb solder lead alloys materials properties mechanical testing soldering solders tin alloys work hardening 23 02 2006 20 07 2006 2007 American Society of Mechanical Engineers ...

... . 22 01 2006 06 06 2006 chip scale packaging circuit reliability solders mechanical testing transient analysis printed circuit testing board-level drop test WLCSP reliability JEDEC The wafer-level chip-scale package (WLCSP) contains a bare die, whose electrical...

... Studies , Hertfordshire, UK. 09 10 2005 15 02 2006 printed circuit design cooling mechanical testing finite element analysis printed circuit boards (PCB) optimal support locations maximum fundamental frequency modal testing A printed circuit board (PCB...

... particles in bond pad aluminum metallization are the potential site of void nucleation. 06 09 2004 23 11 2005 lead bonding integrated circuit packaging integrated circuit metallisation materials testing shear deformation nucleation ductile fracture mechanical testing voids...

.... 13 January 2004 03 June 2004 21 03 2005 adhesive bonding curing adhesives mechanical testing fracture ultraviolet radiation effects electronics packaging Fourier transform spectra infrared spectra integrated circuit testing integrated circuit bonding scanning electron...

... of the particle and exposing the underlying polymeric portion were also observed. 20 02 2004 14 02 2005 anisotropic media electronics packaging mechanical contact contact resistance abrasion friction mechanical testing adhesives anisotropic conductive film (ACF) mechanical shock...

... as indicator of package reliability. 10 April 2000 plastic packaging circuit reliability flip-chip devices heat sinks design of experiments thermal stress cracking mechanical testing finite element analysis inspection Flip Chip Deformation Thermal and Mechanical Loading...

..., 1999. Associate Technical Editor: B. Michel. 15 March 1999 ceramic packaging microassembling integrated circuit bonding solidification shear strength mechanical testing metallography ultrasonic materials testing acoustic microscopy Die Bonding Isothermal Solidification...