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Keywords: mechanical testing
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Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2011, 133(3): 031007.
Published Online: September 14, 2011
... laminates mechanical testing shear strength solders The transition of most microelectronics products to lead free assembly has led to new challenges even for those industry sectors still exempt from the requirement to change solder alloys. The overall volume of products manufactured by the latter...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2010, 132(4): 041003.
Published Online: November 23, 2010
... strength copper alloys creep elastoplasticity electronics packaging fatigue mechanical testing silver alloys solders tensile strength tin alloys 09 12 2009 14 09 2010 23 11 2010 23 11 2010 The method described in Sec. 4 was applied to all the cyclic loadings...
Journal Articles
Article Type: Technical Briefs
J. Electron. Packag. March 2010, 132(1): 014501.
Published Online: February 25, 2010
... as the elastic mismatch. 22 02 2009 18 09 2009 25 02 2010 25 02 2010 delamination mechanical testing shear strength thin films delamination blister test energy release rate phase angle shear effect Thin films have been finding more and more applications in diverse...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2006, 128(4): 405–411.
Published Online: October 4, 2006
... devices nanoparticles soldering assembling fine-pitch technology fatigue testing mechanical testing delamination fatigue cracks fracture passivation silicon compounds To enhance solder bump reliability in flip chips on organic substrates, an epoxy-based underfill is often dispensed...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. September 2007, 129(3): 278–286.
Published Online: July 20, 2006
... 63Sn–37Pb solder lead alloys materials properties mechanical testing soldering solders tin alloys work hardening 23 02 2006 20 07 2006 2007 American Society of Mechanical Engineers ...
Journal Articles
Article Type: Technical Briefs
J. Electron. Packag. March 2007, 129(1): 105–108.
Published Online: June 6, 2006
... . 22 01 2006 06 06 2006 chip scale packaging circuit reliability solders mechanical testing transient analysis printed circuit testing board-level drop test WLCSP reliability JEDEC The wafer-level chip-scale package (WLCSP) contains a bare die, whose electrical...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2006, 128(4): 449–455.
Published Online: February 15, 2006
... Studies , Hertfordshire, UK. 09 10 2005 15 02 2006 printed circuit design cooling mechanical testing finite element analysis printed circuit boards (PCB) optimal support locations maximum fundamental frequency modal testing A printed circuit board (PCB...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2006, 128(3): 192–201.
Published Online: November 23, 2005
... particles in bond pad aluminum metallization are the potential site of void nucleation. 06 09 2004 23 11 2005 lead bonding integrated circuit packaging integrated circuit metallisation materials testing shear deformation nucleation ductile fracture mechanical testing voids...
Journal Articles
Article Type: Article
J. Electron. Packag. March 2005, 127(1): 52–58.
Published Online: March 21, 2005
.... 13 January 2004 03 June 2004 21 03 2005 adhesive bonding curing adhesives mechanical testing fracture ultraviolet radiation effects electronics packaging Fourier transform spectra infrared spectra integrated circuit testing integrated circuit bonding scanning electron...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2005, 127(4): 375–380.
Published Online: February 14, 2005
... of the particle and exposing the underlying polymeric portion were also observed. 20 02 2004 14 02 2005 anisotropic media electronics packaging mechanical contact contact resistance abrasion friction mechanical testing adhesives anisotropic conductive film (ACF) mechanical shock...
Journal Articles
Article Type: Papers On Reliability
J. Electron. Packag. March 2001, 123(1): 83–87.
Published Online: April 10, 2000
... as indicator of package reliability. 10 April 2000 plastic packaging circuit reliability flip-chip devices heat sinks design of experiments thermal stress cracking mechanical testing finite element analysis inspection Flip Chip Deformation Thermal and Mechanical Loading...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. June 2000, 122(2): 168–171.
Published Online: March 15, 1999
..., 1999. Associate Technical Editor: B. Michel. 15 March 1999 ceramic packaging microassembling integrated circuit bonding solidification shear strength mechanical testing metallography ultrasonic materials testing acoustic microscopy Die Bonding Isothermal Solidification...