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Journal Articles

Simultaneous Electrothermal Test Method for Pyroelectric Microsensors

Brian Smith, Cristina Amon
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2007, 129(4): 504–511.
https://doi.org/10.1115/1.2804101
Published Online: August 19, 2007
... of the setup. The thermal model is used to highlight the methodology’s sensitivity to uncertainties in the geometric and material property values of the layers surrounding the pyroelectric film. 03 11 2006 19 08 2007 infrared detectors measurement by laser beam pyroelectric detectors...
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Topics: Heat, Manufacturing, Sensors, Temperature, Thermal conductivity, Thermal diffusion, Thermal properties, Boundary-value problems, Microsensors, Strips
Journal Articles

Vibration Analysis Based Modeling and Defect Recognition for Flip-Chip Solder-Joint Inspection

Sheng Liu, I. Charles Ume
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2002, 124(3): 221–226.
https://doi.org/10.1115/1.1464878
Published Online: July 26, 2002
... devices ball grid arrays chip scale packaging soldering inspection modal analysis finite element analysis vibration measurement light interferometry photoacoustic effect measurement by laser beam Solder bump technology has been proven to be a reliable interconnection method in many...
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Topics: Flip-chip, Flip-chip devices, Inspection, Modeling, Signals, Solder joints, Solders, Vibration, Vibration analysis, Oscillating frequencies
Journal Articles

An Optical Method for Measuring the Two-Dimensional Surface Curvatures of Electronic Packages During Thermal Cycling

Yong Du, Jie-Hua Zhao, Paul Ho
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2001, 123(3): 196–199.
https://doi.org/10.1115/1.1347987
Published Online: March 21, 2000
... is large (Finot et al. 4 ). flip-chip devices chip-on-board packaging plastic packaging curvature measurement measurement by laser beam finite element analysis thermal expansion bending heat treatment 10 September 1999 21 March 2000 Contributed by the Electrical...
View Article titled, An Optical Method for Measuring the Two-Dimensional Surface Curvatures of Electronic Packages During Thermal Cycling
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Topics: Electronic packages, Finite element analysis, Laser beams, Temperature, Flip-chip packages, Warping, Thermal expansion, Deformation, Lasers, Packaging