... nanotubes electronics packaging heat transfer materials testing thermal conductivity thermal interface materials carbon nanotubes thermal resistance Thermal interface materials (TIMs) are used in electronics packaging to increase heat conduction across the interface between two...

..., but Wong ignored the effect of viscoelastic material. PCB drop impact dynamic analysis viscoelasticity materials testing printed circuit testing printed circuits substrates viscoelasticity 21 01 2006 15 03 2007 2007 American Society of Mechanical Engineers ...

... cyclic straining. solders electronics packaging materials testing deformation tin alloys silver alloys solder alloy time-dependent deformation nonproportional loading viscoplasticity constitutive model strain rate sensitivity dwell time In the paper, a memory model...

... bending failure analysis solders materials testing reliability The increasing demand for smaller and faster products in the electronics industry has encouraged the use of chip-scale package (CSP) and ball grid array (BGA) assemblies in a back-to-back or double-sided fashion. Initially, only...

... scanning electron microscopy radiography acoustic microscopy materials testing thermal interface materials interfacial resistance radiography SEM acoustic microscopy The joint between a thermal interface material (TIM) and a heat spreader or silicon back side is rarely a perfect...

... four-point bending wafer thinning integrated circuit packaging materials testing surface roughness mechanical strength bending failure analysis silicon 30 08 2005 06 02 2006 2006 American Society of Mechanical Engineers ...

... particles in bond pad aluminum metallization are the potential site of void nucleation. 06 09 2004 23 11 2005 lead bonding integrated circuit packaging integrated circuit metallisation materials testing shear deformation nucleation ductile fracture mechanical testing voids...

... method with the DSC model for chip-substrate problem. solders finite element analysis calibration materials testing electronics packaging differential scanning calorimetry 01 May 2003 01 January 2004 08 07 2004 Contributed by the Electronic and Photonic Packaging...

... irreversible thermodynamics failure analysis finite element analysis materials testing failure (mechanical) 4 Effect of phase size λ 0 on load-displacement curve for miniature specimen 5 Comparison of Load-displacement curves for miniature specimen Figure 6...