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Keywords: local temporal coherence
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Journal Articles

Detection of Solder Bump Defects in Electronic Packages Using Local Temporal Coherence Analysis of Laser Ultrasonic Signals

Jin Yang, I. Charles Ume
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2009, 131(1): 011013.
https://doi.org/10.1115/1.3068301
Published Online: February 18, 2009
... the transient out-of-plane displacement response on the package surface using the interferometric technique. This paper presents a local temporal coherence (LTC) analysis of laser ultrasound signals and compares it to previous signal-processing methods, including error ratio and correlation coefficient methods...
View Article titled, Detection of Solder Bump Defects in Electronic Packages Using <span class="search-highlight">Local</span> <span class="search-highlight">Temporal</span> <span class="search-highlight">Coherence</span> Analysis of Laser Ultrasonic Signals
Open the PDF for Detection of Solder Bump Defects in Electronic Packages Using <span class="search-highlight">Local</span> <span class="search-highlight">Temporal</span> <span class="search-highlight">Coherence</span> Analysis of Laser Ultrasonic Signals in another window
Topics: Electronic packages, Flip-chip devices, Lasers, Signals, Solders, Tin, Ultrasound, Vehicles, X-rays, Inspection