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Keywords: life testing
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Journal Articles
Article Type: Technical Briefs
J. Electron. Packag. September 2011, 133(3): 034501.
Published Online: September 14, 2011
... an activation energy of 0.87 eV and a Peck parameter of 2.29. MTTF value of 1.582 × 10 6 h at low bias current, 10 mA, has been evaluated. 20 07 2010 19 05 2011 14 09 2011 14 09 2011 failure analysis life testing light emitting diodes semiconductor device reliability...
Journal Articles
Article Type: Book Reviews
J. Electron. Packag. March 2010, 132(1): 016501.
Published Online: March 19, 2010
... 19 03 2010 19 03 2010 integrated circuit design integrated circuit packaging integrated circuit reliability integrated circuit testing life testing printed circuit design printed circuit testing semiconductor device packaging semiconductor device reliability This book...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2009, 131(4): 041001.
Published Online: October 16, 2009
... detection life testing micromechanical devices pressure sensors vacuum techniques vacuum packaging molecular flow leak rate MEMS packaging Much research on vacuum packaging was focused on the electronic vacuum tube packaging before MEMS emergence ( 1 2 3 4 ). Novel MEMS technologies...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. March 2009, 131(1): 011008.
Published Online: February 13, 2009
... integrated circuit packaging integrated circuit reliability life testing silver alloys solders stress-strain relations tin alloys The DLS test vehicle has two solder joint arrays, each composed of nine joints, which are built into an aluminum alloy assembly such that, under tension...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2008, 130(4): 041005.
Published Online: November 17, 2008
.... delamination electronics packaging fatigue testing flip-chip devices life testing nanostructured materials passivation reliability silicon compounds thermal shock thermomechanical treatment 25 07 2005 19 03 2008 17 11 2008 Underfill materials are used in flip chip...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2008, 130(2): 021003.
Published Online: April 15, 2008
... circuit interconnections integrated circuit modelling integrated circuit packaging integrated circuit reliability life testing silver alloys solders tin alloys lead-free solder acceleration factors cohesive zone modeling 2008 American Society of Mechanical Engineers ...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2007, 129(2): 144–148.
Published Online: June 13, 2006
... should not exceed 10 − 13 std. cc ∕ s for 1 year . micro-optomechanical devices electronics packaging encapsulation hermetic seals life testing Optical microelectro mechanical systems (MOEMS) are about high-level integration of many categories...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. March 2007, 129(1): 56–62.
Published Online: May 19, 2006
...Yi-Shao Lai; Chiu-Wen Lee; Chin-Li Kao The high-temperature operation life test (HTOL) was conducted in this paper to study electromigration phenomena of solder interconnects in a flip-chip package assembly. We examined the fatigue reliability and morphological patterns of three solder compositions...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. March 2007, 129(1): 28–34.
Published Online: May 1, 2006
... of simulated package using CFD 23 03 2005 01 05 2006 plastic packaging computational fluid dynamics ball grid arrays flip-chip devices reliability temperature distribution life testing solders finite element analysis power cycling FEA CFD flip chip PBGA ATC ANSYS...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2006, 128(4): 339–345.
Published Online: January 8, 2006
...Sony Mathew; Diganta Das; Michael Osterman; Michael Pecht; Robin Ferebee This paper presents an analysis of an unexpected failure during vibration and shock life test of an electronic circuit board that has been in use for more than 15 years. During testing, an aluminum bracket used to mount...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2005, 127(2): 96–105.
Published Online: June 3, 2005
...-parameter Weibull distributions with life test data of an 1657-pin CCGA package with the 95.5 wt %Sn3.9 wt %Ag0.6 wt %Cu lead-free solder paste on lead-free printed circuit boards under thermal cycling conditions. The other part of this study is to determine the time-history creep strain energy density...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2005, 127(4): 407–414.
Published Online: December 24, 2004
.... , 1995 “Life Evaluation of 63Sn-37Pb Solder Under Push-Pull Creep-Fatigue,” Proc. 37th Symposium on Strength of Materials at High Temperatures, Japan Society of Materials Science , pp. 116 – 120 . 17 12 2004 24 12 2004 electronics packaging fatigue testing solders life testing...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2004, 126(3): 390–397.
Published Online: October 6, 2004
... adhesion metallisation fatigue tensile testing humidity life testing A common failure mechanism of polyimide dielectric is deadhesion by aging-assisted fatigue. Fatigue crack growth results from thermo-mechanical and hygroscopic stresses induced by changes in the temperature and humidity...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2004, 126(3): 398–405.
Published Online: October 6, 2004
... packaging life testing solders electronics packaging cracks stress effects finite element analysis There are many types of thermal fatigue models for determining the solder joint reliability of electronic packages, each with its own merits 1 . These models are dependent on package-level...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. June 2004, 126(2): 256–264.
Published Online: July 8, 2004
... methodology presented in this work. This work is funded in part by the US Air Force Research Laboratory, Wright-Paterson AFB, OH and Northrop Grumman Corporation (Contract Number:F33615-99-2-5500). Suhir , E. , 2002 , “ Accelerated Life Testing (ALT) in Microelectronics and Photonics...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. March 2003, 125(1): 1–3.
Published Online: March 14, 2003
... testing is now beyond any doubt. In particular, the dependence of rupture of time-dependent materials — such as polymers and polymer composites — on an applied constant load and temperature is of practical importance but yet not fully understood. reliability life testing Weibull distribution...
Journal Articles
Article Type: Announcements
J. Electron. Packag. December 2002, 124(4): 432.
Published Online: December 12, 2002
... Kong Tel: (852) 2788 7379 Fax: (852) 2788 7579 e-mail: wywong@ee.cityu.edu. 12 12 2002 reliability failure analysis life testing electronic equipment testing telecommunication standards product liability design engineering First Call for Papers...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. September 2002, 124(3): 184–187.
Published Online: July 26, 2002
... absorption and diffusion through the polymeric underfill, and the resulting hygromechanical viscoplastic stress history. The simulations are combined with accelerated aging tests to assess in-service durability in hot, humid environments. Model predictions are compared with results of accelerated life tests...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. September 2002, 124(3): 205–211.
Published Online: July 26, 2002
... packaging printed circuit manufacture integrated circuit reliability life testing integrated circuit testing The Norton’s steady-state creep relation 17 , (1) d γ crp / dt = B *   exp { − Δ H / kT } τ n is used for creep analysis of the solder joints...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. September 2002, 124(3): 170–177.
Published Online: July 26, 2002
...E. Suhir, ASME Fellow Drop tests are often substituted in qualification or life testing of microelectronic and optoelectronic products by shock tests. The existing (e.g., Telcordia) qualification specifications require that a short term load of the given magnitude and duration (say, an “external...