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Keywords: life testing
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Journal Articles
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. September 2011, 133(3): 034501.
Published Online: September 14, 2011
... environments will help prevent failures in these applications. packaged light emitting diodes reliability catastrophic failures ArrheniusPeck model failure analysis life testing light emitting diodes semiconductor device reliability 20 07 2010 19 05 2011 14 09 2011 14...
Journal Articles
Publisher: ASME
Article Type: Book Reviews
J. Electron. Packag. March 2010, 132(1): 016501.
Published Online: March 19, 2010
... circuit reliability integrated circuit testing life testing printed circuit design printed circuit testing semiconductor device packaging semiconductor device reliability This book entitled “ Mechanical Design of Electronic Systems ” is written from a mechanical design perspective to introduce...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2009, 131(4): 041001.
Published Online: October 16, 2009
... detection life testing micromechanical devices pressure sensors vacuum techniques vacuum packaging molecular flow leak rate MEMS packaging Much research on vacuum packaging was focused on the electronic vacuum tube packaging before MEMS emergence ( 1 2 3 4 ). Novel MEMS technologies...
Journal Articles
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2008, 130(2): 021003.
Published Online: April 15, 2008
... 2007 15 04 2008 copper alloys creep fatigue cracks fatigue testing fracture mechanics integrated circuit interconnections integrated circuit modelling integrated circuit packaging integrated circuit reliability life testing silver alloys solders tin alloys lead-free solder...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2007, 129(2): 144–148.
Published Online: June 13, 2006
... (internal package volume), equivalent leak rates, and equivalent size of interconnected defects in the bonding zone. 16 08 2005 13 06 2006 micro-optomechanical devices electronics packaging encapsulation hermetic seals life testing Optical microelectro mechanical systems (MOEMS...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2007, 129(1): 56–62.
Published Online: May 19, 2006
...Yi-Shao Lai; Chiu-Wen Lee; Chin-Li Kao The high-temperature operation life test (HTOL) was conducted in this paper to study electromigration phenomena of solder interconnects in a flip-chip package assembly. We examined the fatigue reliability and morphological patterns of three solder compositions...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2007, 129(1): 28–34.
Published Online: May 1, 2006
... packages, there are possibilities of γ ATC < γ PC depending upon CTE, Δ T PCB and Δ T SUB . Therefore, PC may generate severe condition than ATC and the assembly that passed life test with ATC may not be safe in the field within its service life. In this regard...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2006, 128(4): 339–345.
Published Online: January 8, 2006
...Sony Mathew; Diganta Das; Michael Osterman; Michael Pecht; Robin Ferebee This paper presents an analysis of an unexpected failure during vibration and shock life test of an electronic circuit board that has been in use for more than 15 years. During testing, an aluminum bracket used to mount...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2005, 127(4): 407–414.
Published Online: December 24, 2004
... method is not a suitable life prediction method for the 63Sn-37Pb solder. 17 12 2004 24 12 2004 electronics packaging fatigue testing solders life testing shear strength creep testing ductility tin alloys lead alloys Solders have been used as a connection material...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2004, 126(3): 390–397.
Published Online: October 6, 2004
... of products against material deadhesion. Shortcomings of such test plans include: ageing polymer films dielectric thin films adhesion metallisation fatigue tensile testing humidity life testing A common failure mechanism of polyimide dielectric is deadhesion by aging-assisted fatigue...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2004, 126(3): 398–405.
Published Online: October 6, 2004
.... C. Lee. 01 April 2004 06 10 2004 reliability chip scale packaging life testing solders electronics packaging cracks stress effects finite element analysis There are many types of thermal fatigue models for determining the solder joint reliability of electronic...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2004, 126(2): 256–264.
Published Online: July 8, 2004
... for accelerated thermal cycling and qualification. Suhir , E. , 2002 , “ Accelerated Life Testing (ALT) in Microelectronics and Photonics: Its Role, Attributes, Challenges, Pitfalls, and Interaction With Qualification Tests ,” ASME J. Electron. Packag. , 124 ( 3 ), September, pp. 281 – 291...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2003, 125(1): 1–3.
Published Online: March 14, 2003
... by the Electronic and Photonic Packaging Division and presented at Poly 2000, London, United Kingdom, December 4-5, 2000. Manuscript received at ASME Headquarters, May 2002. Guest Editor: Bernd Michel. 04 December 2000 01 May 2002 14 03 2003 reliability life testing Weibull distribution...
Journal Articles
Publisher: ASME
Article Type: Announcements
J. Electron. Packag. December 2002, 124(4): 432.
Published Online: December 12, 2002
... 12 12 2002 reliability failure analysis life testing electronic equipment testing telecommunication standards product liability design engineering First Call for Papers: International IEEE Conference on the Business of Electronic Product Reliability and Liability...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2002, 124(3): 170–177.
Published Online: July 26, 2002
...E. Suhir, ASME Fellow Drop tests are often substituted in qualification or life testing of microelectronic and optoelectronic products by shock tests. The existing (e.g., Telcordia) qualification specifications require that a short term load of the given magnitude and duration (say, an “external...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2002, 124(3): 184–187.
Published Online: July 26, 2002
... absorption and diffusion through the polymeric underfill, and the resulting hygromechanical viscoplastic stress history. The simulations are combined with accelerated aging tests to assess in-service durability in hot, humid environments. Model predictions are compared with results of accelerated life tests...