... applications. Furthermore, this study provides the design guideline to develop an advanced no-flow underfill having high performance at high temperature range for the lead-free application. differential scanning calorimetry electronics packaging flip-chip devices lead mass spectroscopic chemical...

..., the sub-time-step method may improve the global computational efficiency significantly. In the following numerical examples, the focus is placed on the local computational efficiency in the user-defined subroutine. The user-specified factor n div is given 1. tin lead solders...

... . Manuscript received May 2002. Associate Editor: Z. Suo. 01 May 2002 17 09 2003 gallium arsenide III-V semiconductors brittle fracture crack-edge stress field analysis soldering indium lead packaging finite element analysis Gallium arsenide (GaAs) semiconductors...

.... It is a “must” reference for any engineer working in the electronics industry. Raytheon, Electronic Systems, Naval & Maritime Integrated Systems, Portsmouth, RI 02871. The third chapter contains the section on lead-free technology. It begins with a review of the lead-free legislative issues...