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Keywords: lead
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Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2009, 131(3): 031014.
Published Online: July 31, 2009
... applications. Furthermore, this study provides the design guideline to develop an advanced no-flow underfill having high performance at high temperature range for the lead-free application. differential scanning calorimetry electronics packaging flip-chip devices lead mass spectroscopic chemical...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. March 2004, 126(1): 148–158.
Published Online: April 30, 2004
..., the sub-time-step method may improve the global computational efficiency significantly. In the following numerical examples, the focus is placed on the local computational efficiency in the user-defined subroutine. The user-specified factor n div is given 1. tin lead solders...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. September 2003, 125(3): 369–377.
Published Online: September 17, 2003
... . Manuscript received May 2002. Associate Editor: Z. Suo. 01 May 2002 17 09 2003 gallium arsenide III-V semiconductors brittle fracture crack-edge stress field analysis soldering indium lead packaging finite element analysis Gallium arsenide (GaAs) semiconductors...
Journal Articles
Article Type: Book Reviews
J. Electron. Packag. September 2002, 124(3): 314.
Published Online: July 26, 2002
.... It is a “must” reference for any engineer working in the electronics industry. Raytheon, Electronic Systems, Naval & Maritime Integrated Systems, Portsmouth, RI 02871. The third chapter contains the section on lead-free technology. It begins with a review of the lead-free legislative issues...